SCHEMBL20344209

SCHEMBL20344209

N=C1C=C(S(=O)(=O)Cl)c2ccccc2C1=O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC2A1 P11166 1/20 0.43
S100A4 P26447 3/20 0.42
PTPN1 P18031 3/20 0.42
CDC25B P30305 4/20 0.41
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
IDO1 P14902 2/20 0.40
DNMT1 P26358 1/20 0.40
DNMT3L Q9UJW3 1/20 0.40
DNMT3A Q9Y6K1 1/20 0.40
MAPT P10636 5/20 0.39
PTPRC P08575 4/20 0.39
MAPK1 P28482 3/20 0.39
KDM4E B2RXH2 3/20 0.39
LMNA P02545 3/20 0.39
BLM P54132 3/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
RAB9A P51151 3/20 0.39
APAF1 O14727 2/20 0.39
TDP2 O95551 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14428558 0.85 SLC2A1 (0.43) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL21344827 0.81 SLC2A1 (0.43) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL18419664 0.81 SLC2A1 (0.43) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL9709505 0.80 PTPN1 (0.63) PTPN1CDC25BMEN1KMT2AIDO1
SCHEMBL18713470 0.79 SLC2A1 (0.42) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL20733345 0.78 SLC2A1 (0.41) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL20653100 0.78 HTR6 (0.45) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL18473411 0.77 SLC2A1 (0.40) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL12419647 0.77 MAPT (0.42) SLC2A1S100A4PTPN1CDC25BMEN1
SCHEMBL19101799 0.74 SLC2A1 (0.38) SLC2A1S100A4PTPN1CDC25BMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210395461-A1 RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, PATTERNED CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM CENTRAL GLASS COMPANY, LIMITED (JP) 2021-12-23 US disclosed
US-20210208502-A1 PHOTORESIST COMPOSITION AND MANUFACTURING METHOD THEREOF, OLED ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF BOE TECHNOLOGY GROUP CO., LTD. (CN) 2021-07-08 US disclosed
EP-1657286-B1 Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye FUJIFILM CORP (JP) 2018-07-04 EP disclosed
US-9778569-B2 Positive photosensitive resin composition, method for producing film using same, and electronic component CENTRAL GLASS COMPANY, LIMITED (JP) 2017-10-03 US disclosed