SCHEMBL2035807

SCHEMBL2035807

CCCc1cc(Cl)c(OC#N)c(Cl)c1

nearest known ligand 0.32

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 2/20 0.31
HTR2C P28335 2/20 0.31
HTR2B P41595 2/20 0.31
POLB P06746 1/20 0.31
ALOX15 P16050 1/20 0.31
HTT P42858 1/20 0.31
SMN1; SMN2 Q16637 2/20 0.31
NPC1 O15118 1/20 0.31
MAPT P10636 1/20 0.31
CASP3 P42574 1/20 0.31
RAB9A P51151 1/20 0.31
SENP8 Q96LD8 1/20 0.31
SENP7 Q9BQF6 1/20 0.31
SENP6 Q9GZR1 1/20 0.31
GLA P06280 1/20 0.30
CSNK2A1 P68400 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5935272 0.80 CYP3A4 (0.34)
SCHEMBL8845657 0.79 FFAR4 (0.35) HTT
SCHEMBL16874395 0.78 THRB (0.38)
SCHEMBL11845896 0.76 ALDH1A1 (0.43) HTR2AHTR2CHTR2BPOLB
SCHEMBL28403768 0.75 ALDH1A1 (0.37) HTR2AHTR2CHTR2BHTTMAPT
SCHEMBL7724157 0.73 TTR (0.36)
SCHEMBL10659248 0.73 POLB (0.33) POLBALOX15HTT
SCHEMBL10061026 0.71 ALDH1A1 (0.41) HTR2AHTR2CHTR2BPOLBSMN1; SMN2
SCHEMBL2590122 0.70 HSP90AA1 (0.35)
SCHEMBL830568 0.69 AR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108350145-B Cyanate ester dual cure resin for additive manufacturing 卡本有限公司 2021-06-22 CN claimed
EP-2167478-A1 BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH Henkel Corporation (US) 2010-03-31 EP claimed
WO-2008156443-A1 BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH HENKEL CORPORATION (US) 2008-12-24 WO claimed
US-6632893-B2 Used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected HENKEL LOCTITE CORPORATION 2003-10-14 US claimed
CN-118266072-A Liquid molding compounds, and reaction products thereof that become electroplatable when exposed to laser energy 汉高股份有限及两合公司 2024-06-28 CN disclosed
WO-2023091578-A1 LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY HENKEL AG & CO. KGAA (DE) 2023-05-25 WO disclosed
CN-115943062-A Dual cure additive manufacturing resin for producing flame retardant objects 卡本有限公司 2023-04-07 CN disclosed
CN-107108883-B Cationically curable benzoxazine compositions 汉高知识产权控股有限责任公司 2022-06-03 CN disclosed
US-20210206898-A1 POLYMERIZABLE COMPOSITION FOR THREE-DIMENSIONAL MODELING, PRODUCTION METHOD OF THREE-DIMENSIONAL MODEL USING SAME, AND THREE-DIMENSIONAL MODEL Konica Minolta, Inc. (JP) 2021-07-08 US disclosed
CN-108350145-B Cyanate ester dual cure resin for additive manufacturing 卡本有限公司 2021-06-22 CN disclosed
CN-112567509-A Liquid compression moulding or encapsulant compositions 汉高知识产权控股有限责任公司 2021-03-26 CN disclosed
CN-111107975-A Resin composition, method for producing three-dimensional object using same, three-dimensional object, fitting for holding object, and industrial robot using same 柯尼卡美能达株式会社 2020-05-05 CN disclosed
WO-2004037878-A2 CO-CURABLE COMPOSITIONS HENKEL CORPORATION (US) 2004-05-06 WO disclosed
US-20030073770-A1 Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent Henkel IP & Holding GmbH (DE) 2003-04-17 US disclosed
EP-1194953-A4 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2002-09-04 EP disclosed
EP-1194953-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2002-04-10 EP disclosed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP disclosed
WO-2000079582-A9 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2001-03-15 WO disclosed
WO-2000079582-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2000-12-28 WO disclosed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO disclosed