Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR4 | Q5NUL3 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | SKP2 | Q13309 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL175692 | 0.82 | SHBG (0.35) | — | |
| SCHEMBL16874395 | 0.79 | THRB (0.38) | — | |
| SCHEMBL2035807 | 0.79 | HTR2A (0.31) | HTT | |
| SCHEMBL9287974 | 0.79 | AR (0.38) | ALDH1A1 | |
| SCHEMBL21462923 | 0.77 | SKP2 (0.39) | FFAR4ALDH1A1HTTSKP2 | |
| SCHEMBL14277969 | 0.75 | ALDH1A1 (0.43) | FFAR4ALDH1A1 | |
| SCHEMBL1742688 | 0.74 | ALDH1A1 (0.36) | ALDH1A1 | |
| SCHEMBL24703698 | 0.74 | FFAR4 (0.36) | FFAR4ALDH1A1HTTSKP2 | |
| SCHEMBL12585748 | 0.74 | SHBG (0.31) | — | |
| SCHEMBL10834534 | 0.74 | FFAR4 (0.38) | FFAR4ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117165078-A | Cyanate resin with low dielectric loss suitable for winding forming process, preparation method and application | 中国科学院宁波材料技术与工程研究所 | 2023-12-05 | — | — | CN | claimed |
| EP-0581268-B1 | Flame-retarded thermosetting resin composition, prepregs and electrical laminates made therefrom | KANEGAFUCHI CHEMICAL IND (JP) | 1997-12-29 | — | — | EP | claimed |
| CN-118043384-A | Prepreg, laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-113260646-B | Aromatic amine resin, maleimide resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-04-02 | — | — | CN | disclosed |
| CN-117529508-A | Amine compound, maleimide compound, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117500850-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117480190-A | Copolymer, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-01-30 | — | — | CN | disclosed |
| CN-117355545-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-117222682-A | Cured resin composition and cured product thereof | 日本化药株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-108603003-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2021-07-20 | — | — | CN | disclosed |
| CN-104755422-B | Method for producing cyanogen halide, cyanate ester compound and method for producing same, and resin composition | 三菱瓦斯化学株式会社 | 2016-11-09 | — | — | CN | disclosed |
| CN-105960427-A | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2016-09-21 | — | — | CN | disclosed |
| CN-105705578-A | Resin composition, prepreg, laminated sheet, and metal-foil-clad laminated board | 三菱瓦斯化学株式会社 | 2016-06-22 | — | — | CN | disclosed |
| CN-100335559-C | High optical contrast resin composition and electronic package utilizing same | IBM (US) | 2007-09-05 | — | — | CN | disclosed |
| CN-1264832-C | Polyhydric phenols, epoxy resins, epoxy resin composition, and cured products thereof | NIPPON KAYAKU KK (JP) | 2006-07-19 | — | — | CN | disclosed |
| CN-1726259-A | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same | KANEGAFUCHI CHEMICAL IND (JP) | 2006-01-25 | — | — | CN | disclosed |
| CN-1268128-A | Polyhydric phenols, epoxy resins, epoxy resin composition, and cured products thereof | NIPPON KAYAKU KK (JP) | 2000-09-27 | — | — | CN | disclosed |
| CN-1226580-A | High optical contrast resin composition and electronic package utilizing same | IBM (US) | 1999-08-25 | — | — | CN | disclosed |