⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL425379 | 0.78 | — | — | |
| SCHEMBL1525979 | 0.78 | — | — | |
| SCHEMBL1525978 | 0.78 | — | — | |
| SCHEMBL423756 | 0.75 | DNM1 (0.32) | — | |
| SCHEMBL424514 | 0.75 | DNM1 (0.32) | — | |
| SCHEMBL1204402 | 0.75 | DNM1 (0.32) | — | |
| SCHEMBL11969452 | 0.75 | DNM1 (0.32) | — | |
| SCHEMBL426518 | 0.75 | DNM1 (0.32) | — | |
| SCHEMBL4922190 | 0.68 | — | — | |
| SCHEMBL4927487 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218217-A1 | THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2024-07-04 | — | — | US | claimed |
| US-20260109849-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-23 | — | — | US | disclosed |
| WO-2025100081-A1 | COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| US-12286541-B2 | Surface-treated sol-gel silica and method for producing same | TOKUYAMA CORPORATION (JP) | 2025-04-29 | — | — | US | disclosed |
| WO-2025009354-A1 | EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE | 旭化成株式会社 | 2025-01-09 | — | — | WO | disclosed |
| US-20240309214-A1 | METHOD FOR MANUFACTURING SURFACE-TREATED SOL-GEL SILICA PARTICLE, SURFACE-TREATED SOL-GEL SILICA PARTICLE, AND TONER EXTERNAL ADDITIVE FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-09-19 | — | — | US | disclosed |
| US-20240218217-A1 | THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2024-07-04 | — | — | US | disclosed |
| EP-4299518-A1 | SURFACE-TREATED SOL-GEL SILICA PARTICLE MANUFACTURING METHOD, SURFACE-TREATED SOL-GEL SILICA PARTICLES, AND TONER EXTERNAL ADDITIVE FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-01-03 | — | — | EP | disclosed |
| CN-115298137-B | Method for producing surface-treated silica powder | 株式会社德山 | 2023-12-19 | — | — | CN | disclosed |
| CN-116897139-A | Method for producing surface-treated sol-gel silica particles, and toner external additive for developing electrostatic images | 信越化学工业株式会社 | 2023-10-17 | — | — | CN | disclosed |
| EP-2509710-B1 | POLYMERIC HYBRID ORGANOMETALLOGLASS | ENVONT LLC (US) | 2015-01-21 | — | — | EP | disclosed |
| US-8920685-B2 | Nanoparticle-resin composition, nanoparticle-resin composite, and method of making nanoparticle-resin composite | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2014-12-30 | — | — | US | disclosed |
| CN-104045976-A | Resin composition | AJINOMOTO KK | 2014-09-17 | — | — | CN | disclosed |
| CN-104053721-A | Resin composition | AJINOMOTO KK | 2014-09-17 | — | — | CN | disclosed |
| CN-103890088-A | Resin composition | AJINOMOTO KK | 2014-06-25 | — | — | CN | disclosed |
| CN-103374219-A | Resin composition | AJINOMOTO KK | 2013-10-30 | — | — | CN | disclosed |
| US-20130004778-A1 | POLYMERIC HYBRID ORGANOMETALLOGLASS | ENVONT LLC | 2013-01-03 | — | — | US | disclosed |
| EP-2509710-A2 | POLYMERIC HYBRID ORGANOMETALLOGLASS | Envont LLC (US) | 2012-10-17 | — | — | EP | disclosed |
| US-20110240931-A1 | NANOPARTICLE-RESIN COMPOSITION, NANOPARTICLE-RESIN COMPOSITE, AND METHOD OF MAKING NANOPARTICLE-RESIN COMPOSITE | SAMSUNG ELECTRONICS CO., LTD (KR) | 2011-10-06 | — | — | US | disclosed |
| WO-2011072045-A2 | POLYMERIC HYBRID ORGANOMETALLOGLASS | ENVONT LLC (US) | 2011-06-16 | — | — | WO | disclosed |