SCHEMBL20484459

SCHEMBL20484459

NNC(=O)c1ccccc1OS(=O)(=O)c1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.60
CTSD P07339 2/20 0.57
MEN1 O00255 2/20 0.54
KMT2A Q03164 2/20 0.54
CA1 P00915 1/20 0.49
CA2 P00918 1/20 0.49
CA9 Q16790 1/20 0.49
ALDH1A1 P00352 6/20 0.47
HTT P42858 3/20 0.43
LMNA P02545 2/20 0.43
METAP2 P50579 1/20 0.42
METAP1 P53582 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
KDM4E B2RXH2 2/20 0.42
EYA2 O00167 1/20 0.42
GAA P10253 1/20 0.42
DHODH Q02127 1/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1665951 0.82 MAPT (0.69) MAPTKMT2AALDH1A1HTTLMNA
SCHEMBL2291597 0.81 MAPT (0.60) MAPTMEN1KMT2AALDH1A1HTT
SCHEMBL1665977 0.79 MAPT (0.70) MAPTMEN1KMT2ACA1CA2
SCHEMBL2296224 0.78 MAPT (0.56) MAPTMEN1KMT2AALDH1A1HTT
SCHEMBL1665284 0.76 MAPT (0.65) MAPTMEN1KMT2AALDH1A1HTT
SCHEMBL6329484 0.76 CTSD (0.72) MAPTCTSDMEN1KMT2ACA1
SCHEMBL2294211 0.76 MAPT (0.53) MAPTKMT2AALDH1A1HTTLMNA
SCHEMBL31272384 0.75 ALDH1A1 (0.68) MAPTMEN1KMT2ACA1CA2
SCHEMBL10572563 0.75 MAPT (1.00) MAPTKMT2AALDH1A1LMNAMETAP2
SCHEMBL2293118 0.75 MAPT (0.52) MAPTMEN1KMT2ACA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3476590-A1 COMPOSITION FOR FOAM, FLEXIBLE THERMOELECTRIC ELEMENT, DUCTILE CONDUCTIVE LAMINATE, AND METHOD FOR MANUFACTURING SAME Tegway Co., Ltd. (KR) 2019-05-01 EP disclosed
US-20190085144-A1 FOAM COMPOSITION, FLEXIBLE THERMOELECTRIC DEVICE, FLEXIBLE CONDUCTIVE LAMINATE AND PRODUCTION METHOD THEREOF TEGWAY CO., LTD. (KR) 2019-03-21 US disclosed
EP-3370270-A1 FLEXIBLE THERMOELECTRIC DEVICE AND METHOD FOR PREPARING SAME Korea Advanced Institute of Science and Technology (KR) 2018-09-05 EP disclosed