SCHEMBL2058705

SCHEMBL2058705

CCCCC=C[SiH](C)O[SiH2][Si](C)(C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853222 0.94 FAAH (0.33)
SCHEMBL9331844 0.94 FAAH (0.33)
Silicate SCHEMBL727212 0.93 LPAR1 (0.31)
SCHEMBL8977627 0.77
SCHEMBL613353 0.74 TSHR (0.32)
SCHEMBL9252237 0.71 TSHR (0.34)
SCHEMBL2432236 0.71 LPAR2 (0.30)
SCHEMBL27777818 0.71 TSHR (0.34)
SCHEMBL9065174 0.69
SCHEMBL8750997 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0860487-B1 Silicone release coating compositions DOW CORNING ASIA LTD (JP) 2000-07-12 EP claimed
US-5945475-A Silicone release coating compositions DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-08-31 US claimed
EP-0845511-A2 Silicone release coating compositions Dow Corning Toray Silicone Company, Ltd. (JP) 1998-06-03 EP claimed
WO-2026100708-A1 PHOTOSENSITIVE RESIN LAMINATE, PHOTOSENSITIVE ELEMENT, AND PATTERN FORMING METHOD 旭化成株式会社 2026-05-15 WO disclosed
WO-2025005146-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND LIKE 旭化成株式会社 2025-01-02 WO disclosed
WO-2024185632-A1 RELEASE FILM, METHOD FOR MANUFACTURING SAME, AND FILM LAMINATE 東レフィルム加工株式会社 2024-09-12 WO disclosed
US-12076913-B2 Feed material for three-dimensional printing containing a polyoxymethylene polymer TICONA LLC (US) 2024-09-03 US disclosed
CN-118541643-A Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern 旭化成株式会社 2024-08-23 CN disclosed
WO-2024085254-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MULTILAYER BODY, AND METHOD FOR FORMING RESIST PATTERN 旭化成株式会社 2024-04-25 WO disclosed
US-20230405408-A1 BUOYANT HIGH COEFFICIENT OF RESTITUTION (CoR) GOLF BALL INCORPORATING AERODYNAMICS TARGETING FLIGHT TRAJECTORY ACUSHNET COMPANY (US) 2023-12-21 US disclosed
EP-3559132-B1 POLYORGANOSILOXANE RELEASE COATING AND METHOD FOR ITS PREPARATION AND USE DOW SHANGHAI HOLDING CO LTD (CN) 2023-11-15 EP disclosed
EP-0761761-B1 Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst DOW CORNING TORAY SILICONE (JP) 2002-02-06 EP disclosed
EP-1178150-A1 Diorganopolysiloxane/acrylate ester copolymer emulsion composition for fabric treatment Dow Corning Toray Silicone Co., Ltd. (JP) 2002-02-06 EP disclosed
EP-1153975-A2 Thermoplastic resin composition and moldings therefrom Dow Corning Toray Silicone Co., Ltd. (JP) 2001-11-14 EP disclosed
EP-1113042-A2 Silicone rubber composition for insert molding or two-cavity molding Dow Corning Toray Silicone Co., Ltd. (JP) 2001-07-04 EP disclosed
US-20010004650-A1 Silicone rubber composition for insert molding or two-cavity molding DOW CORNING TORAY SILICONE, CO. LTD. (JP) 2001-06-21 US disclosed
US-5945475-A Silicone release coating compositions DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-08-31 US disclosed
US-5789334-A PLATINUM CATALYST, DISILOXANE, STORAGE STABILITY, DIMETHYLDIVINYLDIPHENYLDISILOXANE DOW CORNING TORAY SILICONE CO., LTD. (JP) 1998-08-04 US disclosed
EP-0845511-A2 Silicone release coating compositions Dow Corning Toray Silicone Company, Ltd. (JP) 1998-06-03 EP disclosed
EP-0761761-A1 Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-12 EP disclosed