SCHEMBL613353

SCHEMBL613353

CCCCC=C[SiH](C)O[SiH3]

nearest known ligand 0.32

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.32
ALDH1A1 P00352 1/20 0.32
LPAR2 Q9HBW0 2/20 0.32
LPAR3 Q9UBY5 2/20 0.32
PPARA Q07869 1/20 0.32
LPAR1 Q92633 1/20 0.32
F7 P08709 1/20 0.31
F3 P13726 1/20 0.31
FAAH O00519 2/20 0.31
TRPV1 Q8NER1 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2432236 0.96 LPAR2 (0.30) TSHRALDH1A1LPAR2LPAR3PPARA
SCHEMBL8853337 0.92 FAAH (0.42) PPARAF7F3FAAHTRPV1
SCHEMBL17889186 0.77 LPAR2 (0.34) TSHRALDH1A1LPAR2LPAR3LPAR1
SCHEMBL9252237 0.75 TSHR (0.34) TSHRALDH1A1LPAR2LPAR3LPAR1
SCHEMBL27777818 0.75 TSHR (0.34) TSHRALDH1A1LPAR2LPAR3LPAR1
SCHEMBL8992206 0.74 TSHR (0.39) TSHRALDH1A1LPAR2LPAR3PPARA
SCHEMBL2058705 0.74
SCHEMBL5968580 0.74
SCHEMBL216757 0.74
Water SCHEMBL27852585 0.72 TSHR (0.38) TSHRALDH1A1LPAR2LPAR3PPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 562 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331229-B2 Silicone adhesive composition and methods for its preparation and use for electronic device fabrication DOW SILICONES CORPORATION (US) 2025-06-17 US claimed
EP-3673027-B1 DUAL CURE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE DOW SILICONES CORP (US) 2023-11-01 EP claimed
US-20230313008-A1 SILICONE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE FOR ELECTRONIC DEVICE FABRICATION DOW CHEMICAL SILICONES KOREA, LTD. (KR) 2023-10-05 US claimed
EP-4153656-A1 SILICONE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE FOR ELECTRONIC DEVICE FABRICATION Dow Silicones Corporation (US) 2023-03-29 EP claimed
CN-115667370-A Silicone adhesive composition, method for preparing same and use for electronic device manufacture 美国陶氏有机硅公司 2023-01-31 CN claimed
CN-111051461-B Dual cure adhesive compositions and methods of making and using the same 美国陶氏有机硅公司 2022-04-26 CN claimed
CN-111051461-A Dual cure adhesive compositions and methods of making and using the same 美国陶氏有机硅公司 2020-04-21 CN claimed
JP-4597365-B2 2010-12-15 JP claimed
EP-1444298-B9 THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYESTER RESINS DOW CORNING (US) 2010-03-03 EP claimed
EP-1444298-B1 THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYESTER RESINS DOW CORNING (US) 2009-10-07 EP claimed
JP-2002505366-A 2002-02-19 JP claimed
WO-2002008335-A2 THERMOPLASTIC SILICONE ELASTOMERS FROM COMPATIBILIZED POLYAMIDE RESINS DOW CORNING CORPORATION (US) 2002-01-31 WO claimed
WO-2001072903-A2 THERMOPLASTIC SILICONE POLYAMIDE ELASTOMERS DOW CORNING CORPORATION (US) 2001-10-04 WO claimed
US-6281286-B1 DYNAMICALLY CURING BLEND DOW CORNING CORPORATION 2001-08-28 US claimed
WO-2001018116-A1 WITH SILICON RUBBER TOUGHENED THERMOPLASTIC RESINS DOW CORNING CORPORATION (US) 2001-03-15 WO claimed
EP-1060217-A1 THERMOPLASTIC SILICONE ELASTOMERS DOW CORNING CORPORATION (US) 2000-12-20 EP claimed
EP-0860487-B1 Silicone release coating compositions DOW CORNING ASIA LTD (JP) 2000-07-12 EP claimed
US-6013715-A DISPERSING A SILICONE GUM IN A THERMOPLASTIC RESIN WITH A HYDROSILATION CATALYST AND FILLER, VULCANIZING AND DYNAMIC CURING DOW CORNING CORPORATION (US) 2000-01-11 US claimed
WO-1999045072-A1 THERMOPLASTIC SILICONE ELASTOMERS DOW CORNING CORPORATION (US) 1999-09-10 WO claimed
EP-0655483-B1 Curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 1997-09-03 EP claimed