SCHEMBL20957481

SCHEMBL20957481

COc1c(CBr)cccc1-c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDCD1 Q15116 2/20 0.44
CD274 Q9NZQ7 2/20 0.44
DPP4 P27487 1/20 0.41
NR1H4 Q96RI1 1/20 0.40
PDE4B Q07343 3/20 0.39
PDE4A P27815 2/20 0.39
PDE4C Q08493 2/20 0.39
PDE4D Q08499 2/20 0.39
SCN8A Q9UQD0 1/20 0.38
HTR7 P34969 1/20 0.38
ALDH1A1 P00352 2/20 0.36
CYP2A6 P11509 1/20 0.36
MAPK1 P28482 1/20 0.36
ALOX5AP P20292 1/20 0.36
FEN1 P39748 1/20 0.36
ADRA2A P08913 1/20 0.36
ADRA2B P18089 1/20 0.36
ADRA2C P18825 1/20 0.36
KMT2A Q03164 1/20 0.36
MITF O75030 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28517574 0.86 ABL1 (0.46) HTR7MAPT
SCHEMBL29143299 0.86 ALOX5AP (0.39) NR1H4PDE4BPDE4APDE4CPDE4D
SCHEMBL11293298 0.84 PDCD1 (0.59) PDCD1CD274DPP4NR1H4PDE4B
SCHEMBL30728873 0.83 HTR7 (0.43) CD274HTR7ALDH1A1CYP2A6MAPK1
SCHEMBL28841110 0.82 PDCD1 (0.44) PDCD1CD274DPP4NR1H4PDE4B
SCHEMBL27427494 0.82 PDCD1 (0.44) PDCD1CD274DPP4NR1H4PDE4B
SCHEMBL16428829 0.82 DPP4 (0.60) PDCD1CD274DPP4NR1H4PDE4B
SCHEMBL31613044 0.81 HTR1A (0.43) PDCD1CD274DPP4NR1H4SCN8A
SCHEMBL13385087 0.80 PDE4B (0.48) PDCD1CD274NR1H4PDE4BPDE4A
SCHEMBL9078093 0.80 ALDH1A1 (0.40) ALDH1A1MAPK1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111954848-B Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2024-05-03 CN disclosed
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink DIC CORPORATION (JP) 2021-08-03 US disclosed
CN-111954848-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
WO-2019198490-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK DIC CORPORATION (JP) 2019-05-09 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11079675-B2 Compound, photocurable composition, cured product of same, printing ink, and printed matter curing the printing ink EPB41, F12, CDK1 PDCD1 4041/4885CD274 3741/4885DPP4 4612/4885
US-20190137872-A1 NOVEL COMPOUND, PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, PRINTING INK, AND PRINTED MATTER SURING THE PRINTING INK EPB41, CDK1, CDKN1A PDCD1 4049/4885CD274 3748/4885DPP4 4520/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.