SCHEMBL2098306

SCHEMBL2098306

C=Cc1c(CC)ccc2ccccc12

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
GAA P10253 1/20 0.44
ERN1 O75460 1/20 0.43
ATM Q13315 1/20 0.41
ALDH1A1 P00352 1/20 0.41
CYP2A6 P11509 1/20 0.41
TSHR P16473 1/20 0.41
HSD17B10 Q99714 1/20 0.41
MAPT P10636 2/20 0.40
CYP1A2 P05177 1/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
ADRB2 P07550 1/20 0.39
ADRB1 P08588 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
HPGD P15428 1/20 0.39
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29497335 1.00 TDP1 (0.44) TDP1L3MBTL1GAAERN1ATM
SCHEMBL8712215 0.91 HPRT1 (0.48) TDP1L3MBTL1GAAATMALDH1A1
SCHEMBL4525804 0.85 ATM (0.43) TDP1L3MBTL1GAAERN1ATM
SCHEMBL3268984 0.85 ERN1 (0.56) TDP1L3MBTL1GAAERN1ATM
SCHEMBL13583213 0.85 TDP1 (0.44) TDP1L3MBTL1GAAERN1ATM
SCHEMBL2514321 0.85 ERN1 (0.43) TDP1L3MBTL1GAAERN1ALDH1A1
SCHEMBL30062946 0.85 ERN1 (0.43) TDP1L3MBTL1GAAERN1ALDH1A1
SCHEMBL8715352 0.84 CYP1A2 (0.40) TDP1L3MBTL1GAAATMALDH1A1
SCHEMBL9297080 0.83 ALDH1A1 (0.39) TDP1L3MBTL1GAAERN1ALDH1A1
SCHEMBL6385841 0.83 HPGD (0.41) TDP1L3MBTL1GAAERN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 227 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117903353-A Multifunctional vinyl aromatic copolymer and preparation method and application thereof 深圳先进高分子材料研究院 2024-04-19 CN claimed
EP-1373323-B1 CO2-TERMINATED RUBBER FIRESTONE POLYMERS LLC (US) 2007-02-28 EP claimed
EP-3858877-B1 POLYFUNCTIONAL VINYL AROMATIC COPOLYMER AND METHOD FOR MANUFACTURING SAME, COPOLYMER RUBBER OBTAINED THEREFROM, RUBBER COMPOSITION, RUBBER CROSSLINKED MATERIAL, AND TIRE MEMBER NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2026-05-27 EP disclosed
US-12637550-B2 Prepreg and uses thereof TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2026-05-26 US disclosed
US-20260138110-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY WATANABE MASASHI (JP) 2026-05-21 US disclosed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-04-09 US disclosed
EP-4722290-A1 FLUORORUBBER COMPOSITION AND CROSSLINKED MOLDED OBJECT FORMED THEREFROM Zeon Corporation (JP) 2026-04-08 EP disclosed
EP-4714536-A2 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY Zeon Corporation (JP) 2026-03-25 EP disclosed
US-20260078240-A1 HOLLOW PARTICLES, RESIN COMPOSITION AND MOLDED BODY ZEON CORPORATION (JP) 2026-03-19 US disclosed
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2026-03-19 US disclosed
US-20060177666-A1 Curable resin compositions NIPPON STEEL CHEMICAL CO., LTD. (JP) 2006-08-10 US disclosed
CN-1680221-A Production of polycyclic aromatic acetyl compounds NIPPON STEEL CHEMICAL CO (JP) 2005-10-12 CN disclosed
US-6534595-B2 Blend of thermosetting resin, decomposable resin and solvent SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-03-18 US disclosed
EP-1201303-A1 CATIONIC EXCHANGE RESIN Nippon Steel Chemical Co., Ltd. (JP) 2002-05-02 EP disclosed
US-20010038887-A1 Coating solution for forming porous organic film SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-11-08 US disclosed
US-RE35773-E SILOXANE-ADDITION POLYMER COMPOSITE NIPPON SHOKUBAI CO., LTD. (JP) 1998-04-21 US disclosed
US-5558803-A ADDITION-CONDENSATION GRAFT COPOLYMERS FOR DIELECTRIC PARTICLES AND INSULATING LIQUIDS NIPPON SHOKUBAI CO., LTD. (JP) 1996-09-24 US disclosed
US-5376294-A A dielectric particle and a polysiloxane/acrylic ester additive in a dielectric dispersant medium; large shear stress and low current density; stability; nonsettling NIPPON SHOKUBAI CO., LTD. (JP) 1994-12-27 US disclosed
EP-0529166-A1 Electrorheological fluids NIPPON SHOKUBAI CO., LTD. (JP) 1993-03-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260078240-A1 HOLLOW PARTICLES, RESIN COMPOSITION AND MOLDED BODY ARID2, BRWD1, WDR1 TDP1 2008/4885L3MBTL1 3555/4885GAA 3392/4885
US-20260098143-A1 RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION VMA21, ARCN1, RAD51 TDP1 1335/4885L3MBTL1 854/4885GAA 2430/4885
US-12637550-B2 Prepreg and uses thereof WDR33, C9, WDR36 TDP1 1035/4885L3MBTL1 1118/4885GAA 3780/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 TDP1 1275/4885L3MBTL1 1164/4885GAA 2907/4885
US-20260078253-A1 RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME ARCN1, TGFBR1, C1R TDP1 1956/4885L3MBTL1 1727/4885GAA 2434/4885
US-20260138110-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, RESIN COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY SEM1, DAP3, HAO2 TDP1 3488/4885L3MBTL1 4597/4885GAA 1432/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.