SCHEMBL2100519

SCHEMBL2100519

CCCCN(CNCC)[SiH2]CC

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2102951 0.90 TSHR (0.34) TSHR
SCHEMBL2099428 0.76 TSHR (0.33) TSHR
SCHEMBL2101147 0.76 TSHR (0.33) TSHR
SCHEMBL2274193 0.75 CA12 (0.34) TSHR
SCHEMBL2101638 0.75 TSHR (0.32) TSHR
SCHEMBL2102183 0.75 TSHR (0.32) TSHR
SCHEMBL2104285 0.71 TDP1 (0.37)
SCHEMBL16582983 0.69 CA12 (0.37) TSHR
SCHEMBL21255496 0.69 TSHR (0.42) TSHR
SCHEMBL2102495 0.68 CA12 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed