SCHEMBL2102438

SCHEMBL2102438

CCCC[Si](CC)(N(C)C)N(C)C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.32
TSHR P16473 2/20 0.32
LMNA P02545 1/20 0.32
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2099951 0.88 TSHR (0.35) DNM1TSHRLMNATHRB
SCHEMBL2102657 0.85
SCHEMBL2099725 0.83 DNM1 (0.32) DNM1TSHRLMNATHRB
SCHEMBL2101889 0.82
SCHEMBL2100617 0.79
SCHEMBL2102876 0.76 LMNA (0.30) TSHRLMNA
SCHEMBL2101613 0.75
SCHEMBL2103247 0.75
SCHEMBL2266296 0.72 DNM1 (0.32) DNM1TSHRLMNATHRB
SCHEMBL2267526 0.71 TSHR (0.35) DNM1TSHRLMNATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed