SCHEMBL2102622

SCHEMBL2102622

CCN(CC)[Si](c1ccccc1)(c1ccccc1)N(CC)CC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 2/20 0.39
CHRM2 P08172 1/20 0.39
HTR1A P08908 1/20 0.39
ADRA2A P08913 1/20 0.39
CHRM1 P11229 1/20 0.39
DRD1 P21728 1/20 0.39
SLC6A2 P23975 1/20 0.39
SLC6A4 P31645 1/20 0.39
ADRA1A P35348 1/20 0.39
OPRM1 P35372 1/20 0.39
DRD3 P35462 1/20 0.39
SLC6A3 Q01959 1/20 0.39
LMNA P02545 1/20 0.36
TP53 P04637 1/20 0.36
ALDH1A1 P00352 4/20 0.35
TSHR P16473 2/20 0.35
GLA P06280 1/20 0.35
HPGD P15428 2/20 0.35
MAPT P10636 1/20 0.35
AOC3 Q16853 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2102030 0.89 CHRM2 (0.35) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2100019 0.80 TP53 (0.36) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL9979418 0.80 TP53 (0.36) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2271289 0.80 TP53 (0.36) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2102653 0.78 ESR1 (0.37) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2272577 0.78 ESR1 (0.37) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL10626373 0.78 ESR1 (0.37) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL11313986 0.78 TDP1 (0.43) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2101348 0.76 TP53 (0.33) KCNH2CHRM2HTR1AADRA2ACHRM1
SCHEMBL2101242 0.76 ALDH1A1 (0.33) KCNH2CHRM2HTR1AADRA2ACHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119099177-A Siloxane plasma polymers for sheet bonding 康宁股份有限公司 2024-12-10 CN claimed
US-20210362470-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INC (US) 2021-11-25 US claimed
US-20190176435-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INCORPORATED 2019-06-13 US claimed
WO-2018044837-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INCORPORATED (US) 2018-03-08 WO claimed
US-12384917-B1 Physical characteristics of polysilylether polymers in additive manufacturing of energetic materials THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2025-08-12 US disclosed
CN-119099177-A Siloxane plasma polymers for sheet bonding 康宁股份有限公司 2024-12-10 CN disclosed
US-12122138-B2 Siloxane plasma polymers for sheet bonding CORNING INCORPORATED (US) 2024-10-22 US disclosed
US-11661483-B1 Syntheses of polysilylether polymers in additive manufacturing of energetic materials THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 2023-05-30 US disclosed
US-20210362470-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INC (US) 2021-11-25 US disclosed
US-20190176435-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INCORPORATED 2019-06-13 US disclosed
WO-2018044837-A1 SILOXANE PLASMA POLYMERS FOR SHEET BONDING CORNING INCORPORATED (US) 2018-03-08 WO disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed