SCHEMBL2102966

SCHEMBL2102966

Cl[Si](Cl)(Cl)c1ccccc1Br

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.38
MAPK1 P28482 1/20 0.35
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA4 P22748 1/20 0.32
CA6 P23280 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
GAA P10253 1/20 0.31
TAAR1 Q96RJ0 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2D6 P10635 1/20 0.31
TSHR P16473 1/20 0.31
NFKB1 P19838 1/20 0.31
CYP2C19 P33261 1/20 0.31
HSD17B10 Q99714 1/20 0.31
HSD11B1 P28845 1/20 0.31
PMM2 O15305 1/20 0.31
MPI P34949 1/20 0.31
IDO1 P14902 2/20 0.30
PBRM1 Q86U86 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2591827 0.79 ALDH1A1 (0.40) ALDH1A1MAPK1CA1CA2CA4
SCHEMBL2515485 0.78 TSHR (0.35) ALDH1A1TDP1CYP1A2TSHRHSD17B10
SCHEMBL2586783 0.75 ALDH1A1 (0.34) ALDH1A1MAPK1TDP1
SCHEMBL30030347 0.75 ALDH1A1 (0.34) ALDH1A1MAPK1TDP1
SCHEMBL11617289 0.74 ALDH1A1 (0.39) ALDH1A1MAPK1CA1CA2CA4
SCHEMBL9634396 0.74 ALDH1A1 (0.36) ALDH1A1CA1CA2CA4CA6
SCHEMBL3761218 0.72 ALDH1A1 (0.43) ALDH1A1MAPK1CA1CA2CA4
SCHEMBL31168893 0.72 ALDH1A1 (0.43) ALDH1A1MAPK1CA1CA2CA4
SCHEMBL1225074 0.69 TSHR (0.50) ALDH1A1TDP1CYP1A2TSHRHSD11B1
SCHEMBL30300393 0.69 S100A4 (0.43) ALDH1A1MAPK1TDP1TSHRHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103242511-B High-efficiency stable catalytic system and applications thereof to formula of olefin polymerization LIMING RES INST OF CHEMICAL INDUSTRY CO LTD 2015-07-01 CN claimed
CN-103242511-A High-efficiency stable catalytic system and applications thereof to formula of olefin polymerization LIMING RES INST OF CHEMICAL INDUSTRY CO LTD 2013-08-14 CN claimed
EP-0637902-B1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC (US) 1999-03-31 EP claimed
EP-0637902-A1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC. (US) 1995-02-08 EP claimed
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-109716491-B Method for manufacturing field effect transistor and method for manufacturing wireless communication device 东丽株式会社 2023-06-09 CN disclosed
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
EP-3514822-B1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2023-04-26 EP disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-11094899-B2 Method for manufacturing field effect transistor and method for manufacturing wireless communication device TORAY INDUSTRIES, INC. 2021-08-17 US disclosed
EP-3067395-B1 ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER SEIKO EPSON CORP (JP) 2020-10-28 EP disclosed
CN-1224327-A Adhesion enhancement for metal foil GOULD ELECTRONIC INC (US) 1999-07-28 CN disclosed
US-5908542-A CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, GOULD ELECTRONICS INC. (US) 1999-06-01 US disclosed
EP-0637902-B1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC (US) 1999-03-31 EP disclosed
US-5885436-A Adhesion enhancement for metal foil GOULD ELECTRONICS INC. (US) 1999-03-23 US disclosed
EP-0896502-A1 Method of treating metal foil for enhancing adhesion Gould Electronics Inc. (US) 1999-02-10 EP disclosed
US-5622782-A USEFUL IN MANUFACTURE OF PRINTED CIRCUIT BOARDS GOULD INC. (US) 1997-04-22 US disclosed
EP-0637902-A1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC. (US) 1995-02-08 EP disclosed
US-4072655-A Organosilicon compounds as additives for curable organopolysiloxane compositions WACKER-CHEMIE GMBH (DT) 1978-02-07 US disclosed