SCHEMBL2102971

SCHEMBL2102971

CCNC(CC[SiH3])(NCC)c1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 3/20 0.53
KIF11 P52732 3/20 0.33
TAAR1 Q96RJ0 1/20 0.32
NR3C2 P08235 1/20 0.31
DRD2 P14416 1/20 0.31
OPRM1 P35372 1/20 0.31
DRD3 P35462 1/20 0.31
SIGMAR1 Q99720 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
MAPK1 P28482 1/20 0.30
LMNA P02545 1/20 0.30
HTT P42858 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2272802 0.81 KCNN4 (0.53) KCNN4KIF11TAAR1NR3C2DRD2
SCHEMBL2101646 0.80 KCNN4 (0.46) KCNN4KIF11TAAR1SMN1; SMN2MAPK1
SCHEMBL2490805 0.70 KCNN4 (1.00) KCNN4KIF11TAAR1NR3C2MAPK1
SCHEMBL3326124 0.70 KCNN4 (0.67) KCNN4KIF11TAAR1NR3C2MAPK1
SCHEMBL11805262 0.70 KCNN4 (0.67) KCNN4KIF11TAAR1NR3C2MAPK1
SCHEMBL28798433 0.69 KCNN4 (0.64) KCNN4KIF11TAAR1NR3C2MAPK1
SCHEMBL469181 0.69 KCNN4 (0.64) KCNN4KIF11TAAR1NR3C2MAPK1
SCHEMBL2272191 0.68 KCNN4 (0.46) KCNN4KIF11TAAR1SMN1; SMN2MAPK1
SCHEMBL27680840 0.67 KCNN4 (0.46) KCNN4NR3C2DRD2OPRM1DRD3
SCHEMBL19027907 0.67 KCNN4 (0.61) KCNN4KIF11TAAR1NR3C2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed