⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL295852 | 0.85 | — | — | |
| SCHEMBL2530692 | 0.78 | — | — | |
| SCHEMBL336091 | 0.77 | ALDH1A1 (0.31) | — | |
| SCHEMBL4325259 | 0.74 | — | — | |
| SCHEMBL8671705 | 0.71 | KMT2A (0.34) | — | |
| SCHEMBL4365354 | 0.69 | KDM1A (0.33) | — | |
| SCHEMBL919289 | 0.69 | KDM1A (0.33) | — | |
| SCHEMBL28425608 | 0.69 | — | — | |
| SCHEMBL2280969 | 0.69 | CTSK (0.37) | — | |
| SCHEMBL7174781 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11879029-B2 | Polymerizable composition, cycloolefin-based polymer, and metal/resin composite | RIMTEC CORPORATION (JP) | 2024-01-23 | — | — | US | disclosed |
| EP-4011613-A1 | POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, AND METAL/RESIN COMPOSITE | RIMTEC Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| WO-2021024956-A1 | POLYMERIZABLE COMPOSITION, CYCLOOLEFIN-BASED POLYMER, AND METAL/RESIN COMPOSITE | RIMTEC株式会社 | 2021-02-11 | — | — | WO | disclosed |
| US-8716364-B2 | Surface-coated reinforcing material, fluid composition for reaction injection molding, and article formed by reaction injection molding | RIMTEC CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20120259053-A1 | SURFACE-COATED REINFORCING MATERIAL, FLUID COMPOSITION FOR REACTION INJECTION MOLDING, AND ARTICLE FORMED BY REACTION INJECTION MOLDING | RIMTEC CORPORATION (JP) | 2012-10-11 | — | — | US | disclosed |
| US-8164166-B2 | Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20090085170-A1 | INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2009-04-02 | — | — | US | disclosed |