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SCHEMBL21044905

SCHEMBL21044905

CCCC(C)(C)C(=O)N(Cc1ccc(C)cc1)c1ccc(F)c([Ti](c2c(F)ccc(N(Cc3ccc(C)cc3)C(=O)C(C)(C)CCC)c2F)(C2C=CC=C2)C2C=CC=C2)c1F

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
▸ RIPK1 Q13546 6/20 0.36
▸ CNR1 P21554 1/20 0.30
▸ CNR2 P34972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20291447 0.91 RIPK1 (0.40) RIPK1
SCHEMBL21044993 0.84 RIPK1 (0.32) RIPK1
SCHEMBL21044975 0.82 ALDH1A1 (0.33) RIPK1
SCHEMBL21044933 0.82 RIPK1 (0.31) RIPK1
SCHEMBL29479949 0.81 POLB (0.42) RIPK1
SCHEMBL482724 0.80 RIPK1 (0.35) RIPK1
SCHEMBL19970891 0.80 PDK1 (0.39) CNR1CNR2
SCHEMBL20164074 0.79 RIPK1 (0.39) RIPK1
SCHEMBL23854492 0.79 RIPK1 (0.33) RIPK1
SCHEMBL31385563 0.79 RIPK1 (0.41) RIPK1CNR1CNR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 — — CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 — — CN disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 — — EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 — — EP disclosed