SCHEMBL21044975

SCHEMBL21044975

CCCCCCN(C(=O)C(C)(C)CCC)c1ccc(F)c([Ti](c2c(F)ccc(N(CCCCCC)C(=O)C(C)(C)CCC)c2F)(C2C=CC=C2)C2C=CC=C2)c1F

nearest known ligand 0.33

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TP53 P04637 1/20 0.33
RIPK1 Q13546 3/20 0.31
SOAT1 P35610 1/20 0.30
NPC1 O15118 1/20 0.30
JAK2 O60674 1/20 0.30
RAB9A P51151 1/20 0.30
PAX8 Q06710 1/20 0.30
PPARG P37231 1/20 0.30
PPARA Q07869 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21044993 0.96 RIPK1 (0.32) RIPK1
SCHEMBL29480009 0.93 RIPK1 (0.36) ALDH1A1TP53RIPK1PPARGPPARA
SCHEMBL20164078 0.90 ALDH1A1 (0.33) ALDH1A1TP53SOAT1NPC1JAK2
SCHEMBL21044981 0.90 RIPK1 (0.37) RIPK1
SCHEMBL21044916 0.88 ALDH1A1 (0.31) ALDH1A1TP53
SCHEMBL23905221 0.88 RARA (0.31)
SCHEMBL21044933 0.87 RIPK1 (0.31) RIPK1
SCHEMBL23854484 0.87 RIPK1 (0.30) RIPK1
SCHEMBL19970905 0.84 ALDH1A1 (0.31) ALDH1A1TP53
SCHEMBL30661211 0.84 RIPK1 (0.31) RIPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed