SCHEMBL21044974

SCHEMBL21044974

O=C(c1ccc(Cl)cc1)N(c1ccc(F)c([Ti](c2c(F)ccc(N(C(=O)c3ccc(Cl)cc3)C3CCCCC3)c2F)(C2C=CC=C2)C2C=CC=C2)c1F)C1CCCCC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A9 P48067 4/20 0.39
SLC6A5 Q9Y345 1/20 0.39
AGER Q15109 3/20 0.39
ALDH1A1 P00352 2/20 0.38
MEN1 O00255 4/20 0.35
KMT2A Q03164 4/20 0.35
NPC1 O15118 1/20 0.35
POLB P06746 1/20 0.35
CHRM2 P08172 3/20 0.35
CHRM3 P20309 3/20 0.35
MTNR1A P48039 1/20 0.33
CYP2D6 P10635 1/20 0.33
TRPM8 Q7Z2W7 1/20 0.32
KDM4E B2RXH2 1/20 0.32
LMNA P02545 1/20 0.32
ALOX15 P16050 1/20 0.32
ALOX12 P18054 1/20 0.32
RECQL P46063 1/20 0.32
ADAM17 P78536 1/20 0.32
NPSR1 Q6W5P4 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20291436 0.91 ALDH1A1 (0.41) AGERALDH1A1MEN1KMT2ANPC1
SCHEMBL21044990 0.85 HPGD (0.46) SLC6A9SLC6A5AGERALDH1A1MEN1
SCHEMBL482529 0.80 SLC6A9 (0.38) SLC6A9SLC6A5AGERALDH1A1MEN1
SCHEMBL27467773 0.79 SLC6A9 (0.45) SLC6A9SLC6A5AGERALDH1A1MEN1
SCHEMBL21044985 0.78 HTR2C (0.37) SLC6A9MEN1KMT2ALMNANPSR1
SCHEMBL19970893 0.77 CYP1A2 (0.31) LMNAGAA
SCHEMBL29480059 0.74 PDK1 (0.37) ALDH1A1MEN1KMT2ANPC1
SCHEMBL29479971 0.73 HDAC1 (0.38) AGERMEN1KMT2AMTNR1A
SCHEMBL29479974 0.73 S1PR1 (0.42) ALDH1A1MEN1KMT2ANPC1POLB
SCHEMBL29479994 0.73 S1PR1 (0.40) ALDH1A1MEN1KMT2AGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed