SCHEMBL21044985

SCHEMBL21044985

CC(C)N(C(=O)c1ccc(Cl)cc1)c1ccc(F)c([Ti](c2c(F)ccc(N(C(=O)c3ccc(Cl)cc3)C(C)C)c2F)(C2C=CC=C2)C2C=CC=C2)c1F

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HTR2C P28335 1/20 0.37
HDAC8 Q9BY41 1/20 0.34
MDM4 O15151 2/20 0.33
MDM2 Q00987 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
MLYCD O95822 1/20 0.32
SLC6A9 P48067 2/20 0.32
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
LMNA P02545 1/20 0.31
TSHR P16473 1/20 0.31
MAPK1 P28482 1/20 0.31
HTT P42858 1/20 0.31
GPBAR1 Q8TDU6 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20164065 0.91 MLYCD (0.38) HTR2CHDAC8NPSR1MLYCD
SCHEMBL20291434 0.79 S1PR1 (0.41) MEN1KMT2ATSHR
SCHEMBL29479994 0.78 S1PR1 (0.40) MEN1KMT2ATSHR
SCHEMBL29479974 0.78 S1PR1 (0.42) MEN1KMT2AHTT
SCHEMBL21044974 0.78 SLC6A9 (0.39) NPSR1SLC6A9MEN1KMT2ALMNA
SCHEMBL482889 0.78 HTR2C (0.37) HTR2CHDAC8MDM4MDM2MLYCD
SCHEMBL19970891 0.77 PDK1 (0.39) NPSR1MEN1KMT2AMAPK1HTT
SCHEMBL23854492 0.76 RIPK1 (0.33)
SCHEMBL29480033 0.76 TRPM8 (0.34) NPSR1MLYCDTSHR
SCHEMBL27483222 0.76 HTR2C (0.40) HTR2CHDAC8MDM4MDM2NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed