Methacrylic Acid

Methacrylic Acid

SCHEMBL2111774

C=C(C)C(=O)O.CC1(O)C2CC3CC(C2)CC1C3

nearest known ligand 0.37

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Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 7/20 0.35
SMN1; SMN2 Q16637 1/20 0.31
POLB P06746 1/20 0.31
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Adamantane SCHEMBL21924976 0.82 TDP1 (0.38) HSD11B1
Adamantane SCHEMBL131439 0.82 TDP1 (0.38) HSD11B1
Adamantane SCHEMBL22115918 0.82 TDP1 (0.38) HSD11B1
Acrylic Acid SCHEMBL27139580 0.80 LMNA (0.40) HSD11B1
SCHEMBL40305 0.80 ALDH1A1 (0.33) HSD11B1SMN1; SMN2
SCHEMBL17352397 0.80 ALDH1A1 (0.33) HSD11B1SMN1; SMN2
Methacrylic Acid SCHEMBL2110242 0.79 HSD11B1 (0.35) HSD11B1SMN1; SMN2
Methacrylic Acid SCHEMBL28494575 0.79 HSD11B1 (0.32) HSD11B1
Methacrylic Acid SCHEMBL7083287 0.78 HSD11B1 (0.35) HSD11B1EPHX1
Bromide SCHEMBL7549895 0.78 ALDH1A1 (0.32) HSD11B1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119613607-A Preparation method of 193nm photoresist resin 江苏集萃光敏电子材料研究所有限公司 2025-03-14 CN claimed
CN-114380937-B Adamantane-containing photosensitive resin for black matrix photoresist, preparation method thereof, resin composition and application method thereof 江苏博砚电子科技股份有限公司 2023-04-07 CN claimed
CN-114380937-A Adamantane-containing photosensitive resin for black matrix photoresist, preparation method thereof, resin composition and application method thereof 江苏博砚电子科技有限公司 2022-04-22 CN claimed
CN-108132584-B Photoresist composition containing poly (p-hydroxystyrene) polymer and acrylate copolymer 江苏汉拓光学材料有限公司 2020-12-08 CN claimed
CN-111072479-A Method for purifying high-purity 2-methyl-2-adamantanol methacrylate 宁波南大光电材料有限公司 2020-04-28 CN claimed
CN-119613607-A Preparation method of 193nm photoresist resin 江苏集萃光敏电子材料研究所有限公司 2025-03-14 CN disclosed
CN-113943391-B Polymer resin and synthesis method thereof, photoresist containing polymer resin, preparation method of photoresist and use method of photoresist 徐州博康信息化学品有限公司 2024-08-09 CN disclosed
CN-114380937-B Adamantane-containing photosensitive resin for black matrix photoresist, preparation method thereof, resin composition and application method thereof 江苏博砚电子科技股份有限公司 2023-04-07 CN disclosed
CN-114380937-A Adamantane-containing photosensitive resin for black matrix photoresist, preparation method thereof, resin composition and application method thereof 江苏博砚电子科技有限公司 2022-04-22 CN disclosed
CN-113943391-A Polymer resin and synthesis method thereof, photoresist containing polymer resin, preparation method of photoresist and use method of photoresist 江苏汉拓光学材料有限公司 2022-01-18 CN disclosed
CN-109679020-B Cubane-containing acrylate film-forming resin and ArF photoresist as well as preparation method and photoetching method thereof 厦门恒坤新材料科技股份有限公司 2020-12-29 CN disclosed
CN-108132584-B Photoresist composition containing poly (p-hydroxystyrene) polymer and acrylate copolymer 江苏汉拓光学材料有限公司 2020-12-08 CN disclosed
CN-111072479-A Method for purifying high-purity 2-methyl-2-adamantanol methacrylate 宁波南大光电材料有限公司 2020-04-28 CN disclosed
CN-111072479-A Method for purifying high-purity 2-methyl-2-adamantanol methacrylate 宁波南大光电材料有限公司 2020-04-28 CN disclosed
CN-111072479-A Method for purifying high-purity 2-methyl-2-adamantanol methacrylate 宁波南大光电材料有限公司 2020-04-28 CN disclosed
US-8158338-B2 Resist sensitizer MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2012-04-17 US disclosed
WO-2010005428-A1 RESIST SENSITIZER MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT) (US) 2010-01-14 WO disclosed
US-20100009289-A1 RESIST SENSITIZER MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2010-01-14 US disclosed
US-7258963-B2 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-21 US disclosed
US-20060160019-A1 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-07-20 US disclosed