SCHEMBL211364

SCHEMBL211364

[CH2]C(CC(=O)O)OCCOCC

nearest known ligand 0.41

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
TSHR P16473 1/20 0.41
THRB P10828 1/20 0.40
SLC22A6 Q4U2R8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5454693 0.84 TSHR (0.39) ALDH1A1TSHRTHRB
SCHEMBL28052065 0.82 GPR84 (0.35) SLC22A6
SCHEMBL211006 0.81
SCHEMBL9731012 0.80 GABRP (0.38) ALDH1A1TSHRTHRB
SCHEMBL22129515 0.78 GPR84 (0.41) ALDH1A1TSHRSLC22A6
SCHEMBL5666813 0.78 ALDH1A1 (0.42) ALDH1A1TSHRTHRBSLC22A6
SCHEMBL8631854 0.76 TSHR (0.39) ALDH1A1TSHRTHRB
SCHEMBL1079368 0.75 ALDH1A1 (0.44) ALDH1A1TSHRTHRB
SCHEMBL28799965 0.74 ALDH1A1 (0.36) ALDH1A1TSHRTHRB
SCHEMBL14921241 0.73 ALDH1A1 (0.35) ALDH1A1TSHRTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 172 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12025919-B2 Method of storing photoresist coated substrates and semiconductor substrate container arrangement TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-07-02 US disclosed
US-11977333-B2 Semiconductor devices and methods of manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-05-07 US disclosed
US-11971657-B2 Photoresist developer and method of developing photoresist TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-04-30 US disclosed
US-20240118618-A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-04-11 US disclosed
US-20240096623-A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-03-21 US disclosed
US-20240079235-A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-03-07 US disclosed
US-11842896-B2 Semiconductor devices and methods of manufacturing TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-12-12 US disclosed
US-20230393475-A1 METALLIC PHOTORESIST PATTERNING AND DEFECT IMPROVEMENT TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2023-12-07 US disclosed
US-20230393474-A1 PHOTORESIST UNDERLAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-12-07 US disclosed
US-20230384679-A1 PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-11-30 US disclosed
US-20090123880-A1 PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090042147-A1 METHOD OF FORMING PATTERNS FUJIFILM CORPORATION (JP) 2009-02-12 US disclosed
US-7482112-B2 Pattern forming method FUJIFILM CORPORATION (JP) 2009-01-27 US disclosed
US-20080318171-A1 METHOD OF FORMING PATTERNS FUJIFILM CORPORATION (JP) 2008-12-25 US disclosed
EP-2003505-A2 Method of forming patterns FUJIFILM Corporation (JP) 2008-12-17 EP disclosed
EP-2003504-A2 Method of forming patterns FUJIFILM Corporation (JP) 2008-12-17 EP disclosed
US-20070172769-A1 Pattern forming method FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
US-20070172768-A1 Pattern forming method FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
EP-1811339-A1 Pattern forming method Fujifilm Corporation (JP) 2007-07-25 EP disclosed
EP-1811338-A2 Pattern forming method Fujifilm Corporation (JP) 2007-07-25 EP disclosed