SCHEMBL2114305

SCHEMBL2114305

CC(=O)OC(OC(C)=O)c1cc(C)ccc1O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CSNK2A1 P68400 1/20 0.43
TRPA1 O75762 2/20 0.42
TP53 P04637 2/20 0.41
TDP1 Q9NUW8 1/20 0.41
LMNA P02545 5/20 0.40
CHRM1 P11229 3/20 0.40
ADRA1A P35348 2/20 0.40
SLC6A2 P23975 1/20 0.40
HTR2B P41595 1/20 0.40
GAA P10253 5/20 0.39
KMT2A Q03164 4/20 0.39
HPGD P15428 2/20 0.39
HTT P42858 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
ALDH1A1 P00352 4/20 0.38
ALOX15 P16050 2/20 0.38
HSD17B10 Q99714 2/20 0.38
MAPT P10636 4/20 0.37
MEN1 O00255 3/20 0.37
ALOX12 P18054 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL10438029 0.97 CSNK2A1 (0.44) CSNK2A1TRPA1TP53TDP1LMNA
SCHEMBL10438126 0.82 CHRM1 (0.38) CSNK2A1TRPA1TP53TDP1LMNA
SCHEMBL10438024 0.81 ALDH1A1 (0.46) LMNAGAAHTTALDH1A1
SCHEMBL21564954 0.77 MAPT (0.39) TRPA1TDP1LMNACHRM1ADRA1A
SCHEMBL28276798 0.77 TRPA1 (0.48) CSNK2A1TRPA1TP53TDP1LMNA
SCHEMBL10079669 0.76 GAA (0.48) TP53LMNAGAAKMT2AHPGD
SCHEMBL15429257 0.76 CSNK2A1 (0.47) CSNK2A1TRPA1TP53TDP1LMNA
SCHEMBL544302 0.76 GABRA1 (0.48) TP53LMNAGAAKMT2AHTT
SCHEMBL28072644 0.73 CHRM1 (0.39) CSNK2A1TRPA1TP53TDP1LMNA
SCHEMBL9685971 0.72 CYP1A2 (0.46) TDP1LMNAGAAKMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 374 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117806123-A Chemical amplification type negative photosensitive polyimide composition and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 CN claimed
CN-115561966-A Chemical amplification type negative photosensitive polyimide coating adhesive and application 明士(北京)新材料开发有限公司 2023-01-03 CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 CN claimed
CN-114488690-A Chemical amplification type negative polyimide photoresist and preparation method and application thereof 中国科学院化学研究所 2022-05-13 CN claimed
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
EP-0543762-B1 Dry developable photoresist compositions and method for use thereof IBM (US) 2000-02-16 EP claimed
US-5322765-A Dry developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-06-21 US claimed
US-5296332-A Crosslinkable aqueous developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-03-22 US claimed
EP-0543761-A1 Crosslinkable aqueous developable photoresist compositions and method for use thereof International Business Machines Corporation (US) 1993-05-26 EP claimed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-20250382492-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT TORAY INDUSTRIES, INC. (JP) 2025-12-18 US disclosed
US-12473403-B2 Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor FUJIFILM CORPORATION (JP) 2025-11-18 US disclosed
US-12405531-B2 Organic EL display device, production method for cured product, and production method for organic EL display device TORAY INDUSTRIES, INC. (JP) 2025-09-02 US disclosed
EP-0543762-B1 Dry developable photoresist compositions and method for use thereof IBM (US) 2000-02-16 EP disclosed
US-5322765-A Dry developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-06-21 US disclosed
US-5296332-A Crosslinkable aqueous developable photoresist compositions and method for use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1994-03-22 US disclosed
EP-0543762-A1 Dry developable photoresist compositions and method for use thereof International Business Machines Corporation (US) 1993-05-26 EP disclosed
EP-0543761-A1 Crosslinkable aqueous developable photoresist compositions and method for use thereof International Business Machines Corporation (US) 1993-05-26 EP disclosed