Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.48 |
| ▸ | MAOB | P27338 | 7/20 | 0.37 |
| ▸ | MAOA | P21397 | 5/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 5/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 5/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 2/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Aniline SCHEMBL113461 | 0.83 | TSHR (0.44) | TSHRMAOBMAOATDP1CYP3A4 | |
| Aniline SCHEMBL10943399 | 0.82 | TSHR (0.42) | TSHRMAOBMAOATDP1CYP3A4 | |
| Aniline SCHEMBL2114370 | 0.81 | TSHR (0.46) | TSHRMAOBMAOATDP1CYP3A4 | |
| Benzene SCHEMBL27715784 | 0.81 | — | — | |
| Aniline SCHEMBL2117721 | 0.80 | TSHR (0.41) | TSHRMAOBTDP1CYP3A4ALDH1A1 | |
| Naphthalene SCHEMBL27967608 | 0.79 | CYP2A6 (0.40) | TDP1ALDH1A1MAPTKDM4ECYP1A2 | |
| Diphenylether SCHEMBL9580840 | 0.78 | LTA4H (0.52) | TSHRMAOARAB9ASMN1; SMN2NPC1 | |
| Chlorobenzene SCHEMBL27723164 | 0.78 | TSHR (0.48) | TSHRTDP1ALDH1A1L3MBTL1KDM4E | |
| Phenol SCHEMBL27621554 | 0.78 | CA12 (0.48) | TDP1CYP3A4ALDH1A1CYP1A2CYP2C19 | |
| Anisole SCHEMBL27835047 | 0.78 | CA4 (0.61) | MAOBTDP1ALDH1A1MAPTL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117430812-B | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-117430812-A | Photosensitive polyamic acid ester resin, resin composition and application | 明士(北京)新材料开发有限公司 | 2024-01-23 | — | — | CN | claimed |
| EP-4738010-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME | Toray Industries, Inc. (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12545784-B2 | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12534399-B2 | Laminate and manufacturing method of semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2026-01-27 | — | — | US | disclosed |
| EP-4668018-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE | Toray Industries, Inc. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250284195-A1 | CURABLE RESIN COMPOSITION, CURED FILM FORMED THEREFROM, AND ELECTRONIC DEVICE HAVING CURED FILM | SAMSUNG SDI CO LTD (KR) | 2025-09-11 | — | — | US | disclosed |
| US-20250197634-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME | TORAY INDUSTRIES, INC. (JP) | 2025-06-19 | — | — | US | disclosed |
| US-20250164880-A1 | RESIN COMPOSITION, RESIN COMPOSITION FILM AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS | TORAY INDUSTRIES, INC. (JP) | 2025-05-22 | — | — | US | disclosed |
| WO-2025063041-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT USING SAME | 東レ株式会社 | 2025-03-27 | — | — | WO | disclosed |
| US-12247113-B2 | High strength, silane-modified polymer adhesive composition | HENKEL AG & CO. KGAA (DE) | 2025-03-11 | — | — | US | disclosed |
| US-20120251949-A1 | POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2012-10-04 | — | — | US | disclosed |
| US-8158324-B2 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2012-04-17 | — | — | US | disclosed |
| CN-102256785-A | Laminated body, manufacturing method thereof, and laminated circuit board | TOYO BOSEKI | 2011-11-23 | — | — | CN | disclosed |
| US-20100130672-A1 | POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-27 | — | — | US | disclosed |
| US-20100099041-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-2177545-A1 | POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING INSULATING FILM | Sumitomo Bakelite Company Limited (JP) | 2010-04-21 | — | — | EP | disclosed |
| EP-2110708-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2009-10-21 | — | — | EP | disclosed |
| US-20080171830-A1 | Use of Silicon-Containing Polymers as Structural Adhesives | BASF AKTIENGESELLSCHAFT (DE) | 2008-07-17 | — | — | US | disclosed |
| US-20040197484-A1 | Coating liquid for forming insulating film and method for producing insulating film | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-10-07 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12545784-B2 | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device | ASIC1, ASIC3, TET3 | TSHR 4019/4885MAOB 1685/4885MAOA 2055/4885 |
| US-12534399-B2 | Laminate and manufacturing method of semiconductor device | LCP1, CDH1, L1CAM | TSHR 1606/4885MAOB 3483/4885MAOA 2049/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.