SCHEMBL2116811

SCHEMBL2116811

CCCC(Nc1ccccc1)[Si](OCC)(OCC)OCC

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.38
NPSR1 Q6W5P4 2/20 0.35
ALDH1A1 P00352 2/20 0.34
CYP3A4 P08684 2/20 0.34
ALOX15 P16050 2/20 0.34
TSHR P16473 2/20 0.34
ALOX12 P18054 2/20 0.34
HSD17B10 Q99714 2/20 0.34
LMNA P02545 1/20 0.34
THRB P10828 1/20 0.34
RECQL P46063 1/20 0.34
ATM Q13315 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
GAA P10253 3/20 0.34
MAPK1 P28482 1/20 0.33
HIF1A Q16665 1/20 0.33
HPGD P15428 1/20 0.33
AOC3 Q16853 1/20 0.33
KDM4E B2RXH2 2/20 0.32
POLB P06746 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL138740 0.86 TDP1 (0.41) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL2117717 0.85 TDP1 (0.39) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL29055867 0.82 ALDH1A1 (0.34) TDP1ALDH1A1HSD17B10MAPK1KDM4E
SCHEMBL16147719 0.81 TDP1 (0.36) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL2114365 0.77 TDP1 (0.47) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL29055866 0.77 TDP1 (0.38) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL1136012 0.75 TDP1 (0.39) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL3450244 0.75 TDP1 (0.39) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL825516 0.73 TDP1 (0.38) TDP1NPSR1ALDH1A1CYP3A4ALOX15
SCHEMBL3862981 0.72 LTA4H (0.37) ALDH1A1TSHRLMNASMN1; SMN2KCNH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2026-02-10 US disclosed
US-20250164880-A1 RESIN COMPOSITION, RESIN COMPOSITION FILM AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS TORAY INDUSTRIES, INC. (JP) 2025-05-22 US disclosed
WO-2025063041-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT USING SAME 東レ株式会社 2025-03-27 WO disclosed
WO-2025004697-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE 東レ株式会社 2025-01-02 WO disclosed
WO-2025004924-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME 東レ株式会社 2025-01-02 WO disclosed
EP-4484462-A1 RESIN COMPOSITION, RESIN COMPOSITION COATING FILM, RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS Toray Industries, Inc. (JP) 2025-01-01 EP disclosed
WO-2024157672-A1 SOLUBLE POLYMER COMPOUND, METHOD FOR PRODUCING SOLUBLE POLYMER COMPOUND, RESIN COMPOSITION, RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT 東レ株式会社 2024-08-02 WO disclosed
CN-118056271-A Method for manufacturing semiconductor device, temporary fixing material and application of temporary fixing material in manufacturing semiconductor device 株式会社力森诺科 2024-05-17 CN disclosed
WO-2023182041-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME 東レ株式会社 2023-09-28 WO disclosed
WO-2023162718-A1 RESIN COMPOSITION, RESIN COMPOSITION COATING FILM, RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS 東レ株式会社 2023-08-31 WO disclosed
US-9306137-B2 Method of producing crystalline substrate having concave-convex structure TORAY INDUSTRIES, INC. (JP) 2016-04-05 US disclosed
US-20150097204-A1 METHOD OF PRODUCING CRYSTALLINE SUBSTRATE HAVING CONCAVE-CONVEX STRUCTURE TORAY INDUSTRIES, INC. (JP) 2015-04-09 US disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 US disclosed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP disclosed
EP-2110708-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2012-12-05 EP disclosed
EP-2520977-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2012-11-07 EP disclosed
US-20120251949-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2012-10-04 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed
EP-2110708-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2009-10-21 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12545784-B2 Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device ASIC1, ASIC3, TET3 TDP1 2949/4885NPSR1 3324/4885ALDH1A1 3308/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.