Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GFER | P55789 | 2/20 | 0.64 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.64 |
| ▸ | POLB | P06746 | 3/20 | 0.58 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.57 |
| ▸ | XDH | P47989 | 1/20 | 0.55 |
| ▸ | SLC22A12 | Q96S37 | 1/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.53 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.52 |
| ▸ | AKR1C2 | P52895 | 1/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.51 |
| ▸ | GALK1 | P51570 | 1/20 | 0.51 |
| ▸ | CASP6 | P55212 | 1/20 | 0.51 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.51 |
| ▸ | PLEC | Q15149 | 1/20 | 0.51 |
| ▸ | LMNA | P02545 | 1/20 | 0.50 |
| ▸ | HTT | P42858 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.50 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.50 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30307446 | 0.88 | POLB (0.52) | GFERMAPK1POLBHPSEXDH | |
| SCHEMBL140780 | 0.88 | POLB (0.67) | GFERMAPK1POLBHPSEALDH1A1 | |
| SCHEMBL7637726 | 0.88 | POLB (0.67) | GFERMAPK1POLBHPSEALDH1A1 | |
| SCHEMBL29393214 | 0.88 | POLB (0.67) | GFERMAPK1POLBHPSEALDH1A1 | |
| SCHEMBL15011374 | 0.87 | XDH (0.67) | GFERMAPK1POLBXDHSLC22A12 | |
| SCHEMBL10577261 | 0.86 | ALDH1A1 (0.57) | GFERMAPK1POLBXDHSLC22A12 | |
| SCHEMBL15011162 | 0.86 | GFER (0.56) | GFERMAPK1POLBHPSEXDH | |
| SCHEMBL26120494 | 0.86 | GFER (0.56) | GFERMAPK1POLBHPSEXDH | |
| SCHEMBL15011457 | 0.84 | AR (0.56) | GFERMAPK1POLBXDHSLC22A12 | |
| SCHEMBL25642260 | 0.84 | KDM4E (0.67) | GFERMAPK1POLBXDHSLC22A12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112346273-A | Flexible liquid crystal display device | 旭化成株式会社 | 2021-02-09 | — | — | CN | claimed |
| CN-105695977-A | Method for carrying out surface treatment on electrolytic copper foil by virtue of high-heat-resistance organosiloxane film-forming material | 南昌大学 | 2016-06-22 | — | — | CN | claimed |
| CN-101827880-B | Precursor for heat-resistant resin and photosensitive resin composition containing the same | ASAHI KASEI E MATERIALS CORP | 2013-08-21 | — | — | CN | claimed |
| CN-118176259-A | Dispersion of carbon nanotubes, coating liquid composition for electrode using same, electrode, and lithium ion secondary battery | 第一工业制药株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-117321091-B | Maleimide resin, amine resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-118139906-A | Phenol resin, epoxy resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-06-04 | — | — | CN | disclosed |
| CN-113136103-B | Polyimide precursor resin composition | 旭化成株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117924699-A | Polyimide precursor and polyimide resin composition | 旭化成株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-113292853-B | Resin composition, polyimide resin film, and method for producing same | 旭化成株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-113260646-B | Aromatic amine resin, maleimide resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-04-02 | — | — | CN | disclosed |
| CN-113549217-B | Polyimide precursor, resin composition containing same, polyimide resin film, and method for producing same | 旭化成株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-105683836-A | PHOTOSENSITIVE HEAT-CURABLE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD | 太阳油墨制造株式会社 | 2016-06-15 | — | — | CN | disclosed |
| CN-105378564-A | Photosensitive thermosetting resin composition and flexible printed circuit board | TAIYO INK MFG CO LTD | 2016-03-02 | — | — | CN | disclosed |
| CN-105164585-A | Laminate structure, flexible printed wiring board and method for manufacturing same | TAIYO INK MFG CO LTD | 2015-12-16 | — | — | CN | disclosed |
| CN-104854165-A | Resin precursor, resin composition containing the same, resin film and method for producing the same, and laminate and method for producing the same | ASAHI KASEI E MATERIALS CORP | 2015-08-19 | — | — | CN | disclosed |
| CN-104520350-A | Thermoplastic polyimide and laminated body | UNITIKA LTD | 2015-04-15 | — | — | CN | disclosed |
| CN-102047178-B | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2014-05-28 | — | — | CN | disclosed |
| CN-102047179-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2014-02-26 | — | — | CN | disclosed |
| CN-102076740-B | Heat-resistant resin precursor and photosensitive resin composition using same | ASAHI KASEI E MATERIALS CORP | 2013-08-21 | — | — | CN | disclosed |
| CN-101065242-B | Polyimide metal laminate and hard disk suspension using same | MITSUI CHEMICALS INC | 2012-08-29 | — | — | CN | disclosed |