Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.50 |
| ▸ | GAA | P10253 | 2/20 | 0.50 |
| ▸ | MEN1 | O00255 | 2/20 | 0.50 |
| ▸ | MAPT | P10636 | 2/20 | 0.50 |
| ▸ | RECQL | P46063 | 2/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.50 |
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | BLM | P54132 | 1/20 | 0.50 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
| ▸ | MTNR1A | P48039 | 1/20 | 0.50 |
| ▸ | MTNR1B | P49286 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | POLB | P06746 | 1/20 | 0.49 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 3/20 | 0.48 |
| ▸ | CA2 | P00918 | 3/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL51653 | 0.83 | GAA (0.53) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL28632798 | 0.83 | LTA4H (0.47) | ALDH1A1MEN1MAPTRECQLKMT2A | |
| SCHEMBL28924802 | 0.82 | PRKCE (0.41) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL805304 | 0.82 | MTNR1A (0.55) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL1638977 | 0.82 | GAA (0.52) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL6712520 | 0.81 | PRKCE (0.50) | ALDH1A1MEN1MAPTRECQLKMT2A | |
| SCHEMBL28636082 | 0.80 | LTA4H (0.50) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL28647752 | 0.80 | LTA4H (0.50) | ALDH1A1GAAMEN1MAPTKMT2A | |
| SCHEMBL16864025 | 0.80 | GAA (0.50) | ALDH1A1GAAMEN1MAPTRECQL | |
| SCHEMBL22284793 | 0.80 | GAA (0.50) | ALDH1A1GAAMEN1MAPTRECQL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118192168-A | Photosensitive resin composition | 日产化学株式会社 | 2024-06-14 | — | — | CN | disclosed |
| CN-110537146-B | Photosensitive resin composition | 日产化学株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-110537147-B | Photosensitive resin composition | 日产化学株式会社 | 2024-03-12 | — | — | CN | disclosed |
| CN-110573963-B | Photosensitive resin composition | 日产化学株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116848466-A | Positive photosensitive resin composition | 日产化学株式会社 | 2023-10-03 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-110291849-B | Wiring forming method | 日产化学株式会社 | 2023-06-06 | — | — | CN | disclosed |
| CN-110088680-B | Double-layer photosensitive layer roll | 旭化成株式会社 | 2022-12-30 | — | — | CN | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-114245881-A | Photosensitive resin composition | 日产化学株式会社 | 2022-03-25 | — | — | CN | disclosed |
| CN-113820920-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-12-21 | — | — | CN | disclosed |
| CN-108475016-B | Positive photosensitive resin composition | 日产化学工业株式会社 | 2021-09-10 | — | — | CN | disclosed |
| CN-107850844-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-09-07 | — | — | CN | disclosed |
| CN-107003607-B | Positive photosensitive resin composition | 日产化学工业株式会社 | 2021-05-28 | — | — | CN | disclosed |
| WO-2021014956-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2021-01-28 | — | — | WO | disclosed |
| CN-108884355-B | Cured film-forming composition | 日产化学株式会社 | 2020-11-27 | — | — | CN | disclosed |
| CN-111684358-A | Photosensitive resin composition | 日产化学株式会社 | 2020-09-18 | — | — | CN | disclosed |
| CN-105829967-B | Positive photosensitive resin composition | 日产化学工业株式会社 | 2020-02-07 | — | — | CN | disclosed |
| CN-110573963-A | Photosensitive resin composition | 日产化学株式会社 | 2019-12-13 | — | — | CN | disclosed |
| WO-2019156000-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2019-08-15 | — | — | WO | disclosed |