SCHEMBL28647752

SCHEMBL28647752

CCCCOc1ccc(O)c(COC)c1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 3/20 0.50
NR5A1 Q13285 1/20 0.50
MEN1 O00255 1/20 0.48
NPC1 O15118 1/20 0.48
ALDH1A1 P00352 1/20 0.48
GAA P10253 1/20 0.48
MAPT P10636 1/20 0.48
RAB9A P51151 1/20 0.48
KMT2A Q03164 1/20 0.48
L3MBTL1 Q9Y468 1/20 0.48
CNR2 P34972 5/20 0.46
ADRB2 P07550 2/20 0.45
GPR84 Q9NQS5 1/20 0.42
MCL1 Q07820 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28636082 0.93 LTA4H (0.50) LTA4HNR5A1MEN1NPC1ALDH1A1
SCHEMBL28632798 0.86 LTA4H (0.47) LTA4HMEN1NPC1ALDH1A1MAPT
SCHEMBL25329497 0.84 ESR1 (0.53) LTA4HNR5A1MEN1NPC1ALDH1A1
SCHEMBL20817198 0.83 LTA4H (0.49) LTA4HNR5A1MEN1NPC1ALDH1A1
SCHEMBL28632749 0.83 LTA4H (0.49) LTA4HNR5A1MEN1NPC1ALDH1A1
SCHEMBL1053968 0.82 ADRB2 (0.62) LTA4HNR5A1MEN1NPC1ALDH1A1
SCHEMBL21248098 0.80 ALDH1A1 (0.50) MEN1NPC1ALDH1A1GAAMAPT
SCHEMBL224134 0.80 CNR2 (0.59) NR5A1MEN1MAPTKMT2ACNR2
SCHEMBL11606405 0.80 NR5A1 (0.59) LTA4HNR5A1CNR2
SCHEMBL11799012 0.80 CNR2 (0.59) NR5A1MEN1MAPTKMT2ACNR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-109153841-B Resin composition 东丽株式会社 2021-12-31 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN disclosed