SCHEMBL2126289

SCHEMBL2126289

Cc1cc(C)c(N2[C]N(c3c(C)cc(C)cc3C)C(Br)=C2Br)c(C)c1

nearest known ligand 0.36

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
KDM4E B2RXH2 1/20 0.36
RAPGEF4 Q8WZA2 2/20 0.32
POLB P06746 1/20 0.30
MAPT P10636 1/20 0.30
HTT P42858 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1177020 0.81 RAPGEF4 (0.35) ALDH1A1KDM4ERAPGEF4POLBMAPT
SCHEMBL8707807 0.77 RAPGEF4 (0.32) ALDH1A1KDM4ERAPGEF4POLBMAPT
SCHEMBL919716 0.74 CYP1A2 (0.38) ALDH1A1KDM4ERAPGEF4MAPTHTT
SCHEMBL919718 0.74 CYP1A2 (0.38) ALDH1A1KDM4ERAPGEF4MAPTHTT
SCHEMBL18109194 0.71 ALDH1A1 (0.31) ALDH1A1KDM4EPOLBMAPTHTT
SCHEMBL2126293 0.68 ALDH1A1 (0.33) ALDH1A1KDM4ERAPGEF4POLBMAPT
SCHEMBL34511 0.67 SELL (0.36) ALDH1A1KDM4ERAPGEF4POLBMAPT
SCHEMBL14409969 0.67 KDM4E (0.32) ALDH1A1KDM4ERAPGEF4
SCHEMBL15611363 0.66
SCHEMBL1109753 0.66 RAPGEF4 (0.43) ALDH1A1KDM4ERAPGEF4POLBMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11707648-B2 Golf ball SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2023-07-25 US disclosed
US-10721823-B2 Laminate production method INTEL CORPORATION (US) 2020-07-21 US disclosed
US-10716222-B2 Laminate production method INTEL CORPORATION (US) 2020-07-14 US disclosed
EP-2444438-B1 POLYMERIZABLE COMPOSITION, RESIN MOLDED BODY, AND LAMINATE ZEON CORP (JP) 2020-03-18 EP disclosed
EP-2977388-B1 COPOLYMER RUBBER CONTAINING NITRILE GROUP, CROSSLINKABLE RUBBER COMPOSITION, AND RUBBER CROSSLINKED PRODUCT ZEON CORP (JP) 2019-09-04 EP disclosed
EP-2653501-B1 CROSSLINKABLE RESIN MOLDED BODY, AND LAMINATE ZEON CORP (JP) 2019-05-22 EP disclosed
US-20170359907-A1 LAMINATE PRODUCTION METHOD INTEL CORPORATION 2017-12-14 US disclosed
US-20170359908-A1 LAMINATE PRODUCTION METHOD INTEL CORPORATION 2017-12-14 US disclosed
EP-2343340-B2 POLYMERIZABLE COMPOSITION, CROSS-LINKABLE SHAPED ARTICLE, CROSSLINKED SHAPED ARTICLE, AND CROSSLINKED SHAPED ARTICLE COMPOSITE ZEON CORP (JP) 2017-07-26 EP disclosed
US-20160289372-A1 POLYMERIZABLE COMPOSITION, RESIN SHAPED ARTICLE, COMPOSITE, AND LAMINATE ZEON CORPORATION (JP) 2016-10-06 US disclosed
US-20130309512-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, SURFACE TREATED CURED PRODUCT, AND LAMINATE ZEON CORPORATION (JP) 2013-11-21 US disclosed
US-20130267672-A1 CROSS-LINKABLE RESIN SHAPED ARTICLE, CROSS-LINKED RESIN SHAPED ARTICLE AND LAMINATE ZEON CORPORATION (JP) 2013-10-10 US disclosed
EP-2620483-A1 ADHESIVE FILM FOR ORGANIC ELECTROLYTE ACCUMULATOR DEVICES Zeon Corporation (JP) 2013-07-31 EP disclosed
US-20130183519-A1 ADHESIVE FILM FOR ORGANIC ELECTROLYTE-TYPE ENERGY STORAGE DEVICE ZEON CORPORATION (JP) 2013-07-18 US disclosed
EP-2444438-A1 POLYMERIZABLE COMPOSITION, RESIN MOLDED BODY, AND LAMINATE Zeon Corporation (JP) 2012-04-25 EP disclosed
US-8080623-B2 Polymerizable composition, crosslinkable resin, and manufacture methods and applications thereof ZEON CORPORATION (JP) 2011-12-20 US disclosed
EP-2175706-A1 COMPOSITE FOR MULTILAYER CIRCUIT BOARD ZEON CORPORATION (JP) 2010-04-14 EP disclosed
EP-2083032-A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, PROCESS FOR PRODUCTION THEREOF, AND USE THEREOF ZEON CORPORATION (JP) 2009-07-29 EP disclosed
EP-2077289-A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, PROCESS FOR PRODUCING THE SAME, AND USE ZEON CORPORATION (JP) 2009-07-08 EP disclosed
EP-1950236-A1 NORBORNENE RESIN MOLDINGS AND PROCESS FOR PRODUCTION THEREOF Rimtec Corporation (JP) 2008-07-30 EP disclosed