⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4405371 | 0.80 | ALDH1A1 (0.35) | — | |
| SCHEMBL28277656 | 0.79 | ALDH1A1 (0.38) | — | |
| SCHEMBL8390474 | 0.78 | CA2 (0.35) | — | |
| SCHEMBL6812522 | 0.76 | THRB (0.41) | — | |
| SCHEMBL859851 | 0.73 | THRB (0.42) | — | |
| SCHEMBL29196196 | 0.73 | ALDH1A1 (0.39) | — | |
| SCHEMBL15254683 | 0.72 | ALDH1A1 (0.36) | — | |
| SCHEMBL518145 | 0.72 | TSHR (0.43) | — | |
| SCHEMBL12755117 | 0.70 | NAMPT (0.31) | — | |
| SCHEMBL860176 | 0.70 | TSHR (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11759820-B2 | Passivation composition comprising a silane-modified silicate compound | EWALD DORKEN AG | 2023-09-19 | — | — | US | disclosed |
| US-10792702-B2 | Passivation composition comprising a silane-modified silicate compound | EWALD DÖRKEN AG (DE) | 2020-10-06 | — | — | US | disclosed |
| US-20200276610-A1 | PASSIVATION COMPOSITION COMPRISING A SILANE-MODIFIED SILICATE COMPOUND | EWALD DÖRKEN AG (DE) | 2020-09-03 | — | — | US | disclosed |
| US-20170348730-A1 | PASSIVATION COMPOSITION COMPRISING A SILANE-MODIFIED SILICATE COMPOUND | EWALD DÖRKEN AG (DE) | 2017-12-07 | — | — | US | disclosed |
| US-9428605-B2 | Organic-inorganic hybrid material compositions and polymer composites | NEO SITECH LLC (US) | 2016-08-30 | — | — | US | disclosed |
| US-9093279-B2 | Thin film forming composition for lithography containing titanium and silicon | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2015-07-28 | — | — | US | disclosed |
| WO-2015069472-A1 | ORGANIC-INORGANIC HYBRID MATERIAL COMPOSITIONS AND POLYMER COMPOSITES | WANG ZHIKAI (US) | 2015-05-14 | — | — | WO | disclosed |
| US-8962091-B2 | Polyheterosilxoanes for high refractive index materials | DOW CORNING CORPORATION (US) | 2015-02-24 | — | — | US | disclosed |
| WO-2014152392-A1 | COMPOSITION INCLUDING A POLYHETEROSILOXANE AND AN ORGANOSILOXANE BLOCK COPOLYMER | DOW CORNING CORPORATION (US) | 2014-09-25 | — | — | WO | disclosed |
| WO-2014152824-A1 | POLYHETEROSILOXANE COMPOSITION AND SILICONE COMPOSITION INCLUDING A POLYHETEROSILOXANE | DOW CORNING CORPORATION (US) | 2014-09-25 | — | — | WO | disclosed |
| EP-2204472-A2 | Methods for forming wiring and electrode | JSR Corporation (JP) | 2010-07-07 | — | — | EP | disclosed |
| EP-1462544-B1 | Methods for forming wiring and electrode | JSR CORP (JP) | 2010-05-19 | — | — | EP | disclosed |
| US-7429778-B2 | Methods for forming wiring and electrode | JSR CORPORATION (JP) | 2008-09-30 | — | — | US | disclosed |
| US-20060224244-A1 | Hydrogel implant | ZIMMER TECHNOLOGY, INC. | 2006-10-05 | — | — | US | disclosed |
| US-7071084-B2 | Methods for forming wiring and electrode | JSR CORPORATION (JP) | 2006-07-04 | — | — | US | disclosed |
| US-20060024937-A1 | Methods for forming wiring and electrode | JSR CORPORATION (JP) | 2006-02-02 | — | — | US | disclosed |
| US-6953600-B2 | Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices | JSR CORPORATION (JP) | 2005-10-11 | — | — | US | disclosed |
| US-20040192038-A1 | Methods for forming wiring and electrode | JSR CORPORATION (JP) | 2004-09-30 | — | — | US | disclosed |
| EP-1462544-A2 | Methods for forming wiring and electrode | JSR Corporation (JP) | 2004-09-29 | — | — | EP | disclosed |
| US-20030224152-A1 | Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices | JSR CORPORATION (JP) | 2003-12-04 | — | — | US | disclosed |