SCHEMBL21295575

SCHEMBL21295575

C[CH]OC(CC)CCCCCCC

nearest known ligand 0.40

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.37
DNM1 Q05193 2/20 0.36
ADH1B P00325 1/20 0.35
ADH1C P00326 1/20 0.35
ADH1A P07327 1/20 0.35
ADH4 P08319 1/20 0.35
ADH7 P40394 1/20 0.35
CTSK P43235 1/20 0.35
TSHR P16473 1/20 0.35
THRB P10828 1/20 0.35
OPRM1 P35372 1/20 0.34
SMPD1 P17405 3/20 0.34
FDPS P14324 3/20 0.33
GPR84 Q9NQS5 2/20 0.33
ZDHHC7 Q9NXF8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4870164 0.98 CTSK (0.36) LMNADNM1ADH1BADH1CADH1A
SCHEMBL8378685 0.91 LMNA (0.39) LMNADNM1ADH1BADH1CADH1A
SCHEMBL8379541 0.91 LMNA (0.39) LMNADNM1ADH1BADH1CADH1A
SCHEMBL5949233 0.87 LMNA (0.37) LMNADNM1ADH1BADH1CADH1A
SCHEMBL3317322 0.81
SCHEMBL18188004 0.81 ADH1B (0.42) LMNAADH1BADH1CADH1AADH4
SCHEMBL20599262 0.81 TSHR (0.38) LMNADNM1ADH1BADH1CADH1A
SCHEMBL3040229 0.81 ADH1B (0.42) LMNAADH1BADH1CADH1AADH4
SCHEMBL11697875 0.81 TSHR (0.38) LMNADNM1ADH1BADH1CADH1A
SCHEMBL18187976 0.81 ADH1B (0.42) LMNAADH1BADH1CADH1AADH4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2020196362-A1 MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY 富士フイルム株式会社 2020-10-01 WO disclosed
WO-2020195995-A1 MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY 富士フイルム株式会社 2020-10-01 WO disclosed
WO-2019163859-A1 PHOTOSENSITIVE LAYER, LAMINATE, PHOTOSENSITIVE RESIN COMPOSITION, KIT, AND PRODUCTION METHOD FOR PHOTOSENSITIVE RESIN COMPOSITION 富士フイルム株式会社 2019-08-29 WO disclosed