SCHEMBL2153575

SCHEMBL2153575

O=C1C=CC(=O)C(c2ccccc2)(c2ccccc2)C1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.36
CYP2C9 P11712 2/20 0.36
MEN1 O00255 2/20 0.36
GSK3A P49840 1/20 0.35
GSK3B P49841 1/20 0.35
GAA P10253 2/20 0.33
MAPT P10636 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
CFTR P13569 1/20 0.33
GOPC Q9HD26 1/20 0.33
RAB9A P51151 1/20 0.33
LMNA P02545 1/20 0.32
BACE1 P56817 1/20 0.32
EGFR P00533 1/20 0.32
PKM P14618 1/20 0.32
ALDH1A1 P00352 2/20 0.31
CACNA1F O60840 1/20 0.31
HTR2A P28223 1/20 0.31
HRH1 P35367 1/20 0.31
SCN1A P35498 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8992358 0.72 CYP2C9 (0.38) KMT2ACYP2C9MEN1MAPTSMN1; SMN2
SCHEMBL15657386 0.72 CFTR (0.45) KMT2ACYP2C9MEN1GAAMAPT
SCHEMBL9454011 0.72 SMN1; SMN2 (0.37) KMT2ACYP2C9MEN1SMN1; SMN2ALDH1A1
SCHEMBL21819037 0.71 NFKB1 (0.33) KMT2ACYP2C9MEN1CFTRGOPC
SCHEMBL8992285 0.68 CYP2C9 (0.38) KMT2ACYP2C9MEN1GAAMAPT
SCHEMBL28353272 0.65 MMP2 (0.38) KMT2ACYP2C9MEN1SMN1; SMN2RAB9A
SCHEMBL10970570 0.64 BACE1 (0.43) KMT2ACYP2C9MEN1MAPTLMNA
SCHEMBL16529973 0.62 OPRM1 (0.42) LMNAKCNH2MAOAMAOBTSHR
SCHEMBL4095120 0.62 MAOB (0.41) EGFRKCNH2MAOAMAOB
SCHEMBL28618193 0.62 MAOB (0.38) KMT2ACYP2C9MEN1MAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115997921-A Use of assai for improving skin conditions 黑龙江飞鹤乳业有限公司 2023-04-25 CN disclosed
CN-109641997-A Curable resin composition, fuel cell using the same, and sealing method 三键有限公司 2019-04-16 CN disclosed
CN-109476925-A Curable resin composition, cured product, fuel cell, and sealing method 三键有限公司 2019-03-15 CN disclosed
CN-109312165-A Curable resin composition, fuel cell, and sealing method 三键有限公司 2019-02-05 CN disclosed
CN-108699310-A Hardening resin composition, fuel cell and encapsulating method 三键有限公司 2018-10-23 CN disclosed
CN-102105546-B Method for temporarily fixing/peeling member and adhesive suitable for temporary fixing 电化株式会社 2016-12-07 CN disclosed
CN-104144786-B Surface protective plate, e-machine and the manufacture method of e-machine parts 木本股份有限公司 2016-11-02 CN disclosed
CN-105911817-A Photo-electric sensitivity composition, hardening film making method, hardening film, touch screen and display screen 富士胶片株式会社 2016-08-31 CN disclosed
CN-105911818-A Photoresist composition, hardening film making method, hardening film and application thereof 富士胶片株式会社 2016-08-31 CN disclosed
CN-104871044-A Color filter, black matrix, or curable resin composition for circuit formation DAI ICHI KOGYO SEIYAKU CO LTD 2015-08-26 CN disclosed
CN-101194543-A Electromagnetic wave shielding laminate and method for producing same TOYO INK MFG CO (JP) 2008-06-04 CN disclosed
WO-2008062903-A1 RADICALLY POLYMERIZABLE COMPOUND HAVING A DITHIOCARBONATE STRUCTURE AND A SULFUR-CONTAINING ALLYLCARBONATE SHOWA DENKO K.K. (JP) 2008-05-29 WO disclosed
CN-101047202-A Manufacturing method for luminescent device, luminescent device and electric device SEIKO EPSON CORP (JP) 2007-10-03 CN disclosed
WO-2006075723-A1 CONDUCTIVE POLYMER, CONDUCTIVE LAYER, ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT SEIKO EPSON CORPORATION (JP) 2006-07-20 WO disclosed
WO-2006075724-A1 CONDUCTIVE POLYMER, CONDUCTIVE LAYER, ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT SEIKO EPSON COPORATION (JP) 2006-07-20 WO disclosed
WO-2003010124-A1 POLYMERIZABLE COMPOUND, polymeRIZABLE COMPOSITION AND CURED PRODUCT CONTAINING THE COMPOUND SHOWA DENKO K. K. (JP) 2003-02-06 WO disclosed
CN-1068025-C Extrudable thermoplastic composition comprising a compatibilized polyphenylene ether polyamide resin blend GEN ELECTRIC (US) 2001-07-04 CN disclosed
CN-1146467-A Process for preparing phosphorus series flame-retardant unsaturated polyester FINANCIAL GROUP CORP IND TECH (CN) 1997-04-02 CN disclosed
CN-1126224-A Extrudable thermoplastic composition comprising a compatibilized polyphenylene ether polyamide resin blend GEN ELECTRIC (US) 1996-07-10 CN disclosed
CN-1106840-A Thermoplastic composition comprising a compatibilized polyphenylene etherpolyamide base resin, one or more phosphorus compounds GEN ELECTRIC (US) 1995-08-16 CN disclosed