SCHEMBL2157273

SCHEMBL2157273

COC([SiH3])(CCCNc1ccccc1)OC

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.53
ALDH1A1 P00352 2/20 0.53
L3MBTL1 Q9Y468 1/20 0.39
KCNH3 Q9ULD8 3/20 0.38
PPARG P37231 1/20 0.37
HTR7 P34969 1/20 0.36
GAA P10253 1/20 0.36
TSHR P16473 1/20 0.34
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2C19 P33261 1/20 0.34
ICMT O60725 1/20 0.34
BCHE P06276 1/20 0.33
ACHE P22303 1/20 0.33
CA12 O43570 1/20 0.33
CA2 P00918 1/20 0.33
CA9 Q16790 1/20 0.33
KDM1A O60341 1/20 0.33
EHMT2 Q96KQ7 1/20 0.33
RCOR1 Q9UKL0 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3687978 0.83 ALDH1A1 (0.50) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL57448 0.78 MAPT (0.41) MAPTALDH1A1L3MBTL1KCNH3TSHR
SCHEMBL2445099 0.77 MAOA (0.55) MAPTGAABCHEKDM4E
SCHEMBL974894 0.76 MAPT (0.53) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL2784116 0.73 CNR1 (0.51) ALDH1A1L3MBTL1GAALMNAHTT
SCHEMBL28407590 0.73 MAPT (0.46) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL976198 0.72 MAPT (0.53) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL825908 0.72 MAPT (0.44) MAPTALDH1A1L3MBTL1GAATSHR
SCHEMBL4970157 0.72 ALDH1A1 (0.89) MAPTALDH1A1L3MBTL1KCNH3ACHE
SCHEMBL2065279 0.72 ALDH1A1 (1.00) MAPTALDH1A1L3MBTL1KCNH3TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12104077-B2 Curable coating agent composition and cured coating film THREEBOND CO., LTD. (JP) 2024-10-01 US disclosed
WO-2023162664-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-31 WO disclosed
WO-2023145711-A1 CURABLE COMPOSITION AND USE OF SAME 株式会社カネカ 2023-08-03 WO disclosed
WO-2023074462-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR 株式会社カネカ 2023-05-04 WO disclosed
CN-113453886-B Curable coating agent composition and cured coating film 三键有限公司 2023-04-18 CN disclosed
WO-2023054700-A1 CURABLE COMPOSITION 株式会社カネカ 2023-04-06 WO disclosed
US-20230076565-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2023-03-09 US disclosed
EP-4134390-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2023-02-15 EP disclosed
EP-4105262-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2022-12-21 EP disclosed
US-20220145124-A1 CURABLE COATING AGENT COMPOSITION AND CURED COATING FILM THREEBOND CO., LTD. (JP) 2022-05-12 US disclosed
EP-1985666-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-10-29 EP disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed
EP-1117102-B1 Method of manufacturing material for forming insulating film JSR CORP (JP) 2005-08-10 EP disclosed
US-6642352-B2 Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound JSR CORPORATION (JP) 2003-11-04 US disclosed
EP-0844283-B1 Curable resin composition and cured products JSR CORP (JP) 2002-10-09 EP disclosed
US-6313233-B1 CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-11-06 US disclosed
US-20010009936-A1 Method of manufacturing material for forming insulating film JSR CORPORATION (JP) 2001-07-26 US disclosed
EP-1117102-A2 Method of manufacturing material for forming insulating film JSR Corporation (JP) 2001-07-18 EP disclosed
US-6011123-A ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. JSR CORPORATION (JP) 2000-01-04 US disclosed
EP-0844283-A1 Curable resin composition and cured products JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-27 EP disclosed