Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.33 |
| ▸ | ADORA1 | P30542 | 2/20 | 0.33 |
| ▸ | PDPK1 | O15530 | 2/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.31 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.31 |
| ▸ | MAP3K5 | Q99683 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 2/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | NPC1 | O15118 | 1/20 | 0.31 |
| ▸ | HEXA | P06865 | 1/20 | 0.30 |
| ▸ | HEXB | P07686 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL157393 | 0.86 | NOS2 (0.36) | KDM4EALOX15L3MBTL1ADORA2AADORA1 | |
| SCHEMBL33591 | 0.78 | BACE1 (0.38) | ADORA1PDPK1MAPT | |
| SCHEMBL16267855 | 0.78 | BACE1 (0.32) | PDPK1 | |
| SCHEMBL8324752 | 0.75 | KDM4E (0.38) | KDM4EALOX15L3MBTL1ADORA2AADORA1 | |
| SCHEMBL8158698 | 0.74 | KDM4E (0.33) | KDM4EALOX15L3MBTL1 | |
| SCHEMBL8012285 | 0.73 | TLR8 (0.39) | KDM4EADORA2AADORA1ADORA3RAB9A | |
| SCHEMBL1198712 | 0.73 | CDK1 (0.32) | KDM4EALOX15L3MBTL1 | |
| SCHEMBL1199229 | 0.71 | — | — | |
| SCHEMBL5983208 | 0.70 | CASP1 (0.39) | — | |
| SCHEMBL21409794 | 0.70 | HTR2A (0.35) | PDPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1111972-B1 | Flexible printed substrate | SONY CHEM & INF DEVICE CORP (JP) | 2007-05-23 | — | — | EP | claimed |
| US-7098267-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2006-08-29 | — | — | US | claimed |
| CN-1213117-C | Polyamide acid varnish compsns. and flexible printing base plate | SONY CHEMICALS CO LTD (JP) | 2005-08-03 | — | — | CN | claimed |
| US-20050027099-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2005-02-03 | — | — | US | claimed |
| US-6805967-B2 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. (JP) | 2004-10-19 | — | — | US | claimed |
| EP-1108762-B1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP (JP) | 2004-09-15 | — | — | EP | claimed |
| EP-1014765-B1 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | SONY CHEMICALS CORP (JP) | 2003-03-12 | — | — | EP | claimed |
| US-6395399-B2 | METALLIC FOIL, E.G. COPPER, HAVING A POLYIMIDE LAYER PRODUCED BY FORMING A FILM OF A POLYAMIC ACID VARNISH FOLLOWED BY IMIDATING AND HAVING A SPECIFIC EXPANSION COEFFICIENT AND SOFTENING POINT; PRINTED CIRCUITS; NONCURLING | SONY CHEMICALS CORP. (JP) | 2002-05-28 | — | — | US | claimed |
| US-6355357-B1 | RUST RESISTANT POLYIMIDE INSULATING LAYER | SONY CHEMICALS CORP. (JP) | 2002-03-12 | — | — | US | claimed |
| US-20010005730-A1 | Polyamic acid varnish composition and a flexible printed board | SONY CHEMICALS CORP. | 2001-06-28 | — | — | US | claimed |
| EP-1111972-A2 | Flexible printed substrate | Sony Chemicals Corporation (JP) | 2001-06-27 | — | — | EP | claimed |
| US-20010004496-A1 | Flexible printed substrate | SONY CHEMICALS CORP. | 2001-06-21 | — | — | US | claimed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | claimed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | claimed |
| US-8986833-B2 | Enamel varnish composition for enamel wire and enamel wire using same | LS CABLE LTD. (KR) | 2015-03-24 | — | — | US | disclosed |
| EP-1355518-B1 | FLEXIBLE PRINTED WIRING BOARD | SONY CHEM & INF DEVICE CORP (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-2357876-A1 | ELECTROCONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS TO EACH OTHER USING THE ELECTROCONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR MANUFACTURING CONNECTING TERMINAL | Sumitomo Bakelite Company Limited (JP) | 2011-08-17 | — | — | EP | disclosed |
| US-20010004496-A1 | Flexible printed substrate | SONY CHEMICALS CORP. | 2001-06-21 | — | — | US | disclosed |
| EP-1108762-A2 | Polyamic acid varnish composition and a flexible printed board | Sony Chemicals Corporation (JP) | 2001-06-20 | — | — | EP | disclosed |
| EP-1014765-A2 | Flexible printed board, polyamic acid and polyamic acid varnish containing same | Sony Chemicals Corporation (JP) | 2000-06-28 | — | — | EP | disclosed |