Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2A | P28223 | 1/20 | 0.35 |
| ▸ | HTR1A | P08908 | 1/20 | 0.33 |
| ▸ | HTR1D | P28221 | 1/20 | 0.33 |
| ▸ | HTR1B | P28222 | 1/20 | 0.33 |
| ▸ | PDPK1 | O15530 | 1/20 | 0.33 |
| ▸ | PI4KA | P42356 | 1/20 | 0.33 |
| ▸ | PI4K2B | Q8TCG2 | 1/20 | 0.33 |
| ▸ | PI4K2A | Q9BTU6 | 1/20 | 0.33 |
| ▸ | PI4KB | Q9UBF8 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | DHFR | P00374 | 1/20 | 0.32 |
| ▸ | CDK1 | P06493 | 1/20 | 0.32 |
| ▸ | CCNB1 | P14635 | 1/20 | 0.32 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.32 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL157393 | 0.76 | NOS2 (0.36) | PDPK1DHFR | |
| SCHEMBL16460924 | 0.75 | CASP1 (0.38) | PDPK1PI4KAPI4K2BPI4K2API4KB | |
| SCHEMBL546259 | 0.75 | CASP1 (0.38) | PDPK1PI4KAPI4K2BPI4K2API4KB | |
| SCHEMBL11429116 | 0.75 | GPR84 (0.35) | PI4KAPI4K2BPI4K2API4KBPKM | |
| SCHEMBL8016347 | 0.72 | TLR8 (0.47) | PI4KAPI4K2BPI4K2API4KBALDH1A1 | |
| Bromide SCHEMBL29291042 | 0.71 | HTR2A (0.43) | HTR2AHTR1AHTR1DHTR1BPI4KA | |
| SCHEMBL2157690 | 0.70 | KDM4E (0.35) | PDPK1 | |
| SCHEMBL16267855 | 0.69 | BACE1 (0.32) | PDPK1 | |
| SCHEMBL2849132 | 0.69 | HTR2A (0.44) | HTR2AHTR1AHTR1DHTR1BALDH1A1 | |
| SCHEMBL4374043 | 0.68 | PI4KA (0.44) | PI4KAPI4K2BPI4K2API4KBALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119054059-A | Method for manufacturing semiconductor device and semiconductor device | 株式会社力森诺科 | 2024-11-29 | — | — | CN | disclosed |
| CN-118027412-A | Photo-alignment material | 罗利克技术有限公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-117279966-A | Epoxy resin modifier, epoxy resin composition containing the same, adhesive comprising the epoxy resin composition, and resin cured product obtained by curing the epoxy resin composition | 大塚化学株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-116789871-A | Composition for forming cured film, alignment material, and retardation material | 日产化学株式会社 | 2023-09-22 | — | — | CN | disclosed |
| CN-110461887-B | Composition for forming cured film, alignment material, and phase difference material | 日产化学株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-110234723-B | Conductive adhesive | 拓自达电线株式会社 | 2023-02-28 | — | — | CN | disclosed |
| CN-109153837-B | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | 昭和电工材料株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-110713815-B | Conductive adhesive, electromagnetic wave shielding film and shielding printed wiring substrate | 拓自达电线株式会社 | 2022-04-01 | — | — | CN | disclosed |
| CN-110249016-B | Conductive adhesive | 拓自达电线株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-110461964-B | Composition for forming cured film, alignment material, and phase difference material | 日产化学株式会社 | 2021-12-31 | — | — | CN | disclosed |
| CN-109563388-B | Conductive adhesive | 拓自达电线株式会社 | 2021-06-08 | — | — | CN | disclosed |
| CN-112041713-A | Composition for forming cured film, alignment material, and phase difference material | 日产化学株式会社 | 2020-12-04 | — | — | CN | disclosed |
| CN-112020663-A | Composition for forming cured film, alignment material, and phase difference material | 日产化学株式会社 | 2020-12-01 | — | — | CN | disclosed |
| CN-107849223-B | Epoxy resin composition, process for producing the same, and use of the same | 住友精化株式会社 | 2020-07-28 | — | — | CN | disclosed |
| CN-110998892-A | Battery packaging material and battery | 大日本印刷株式会社 | 2020-04-10 | — | — | CN | disclosed |
| CN-110713815-A | Conductive adhesive, electromagnetic wave shielding film and shielding printed wiring substrate | 拓自达电线株式会社 | 2020-01-21 | — | — | CN | disclosed |
| WO-2019189221-A1 | POLYETHYLENE TEREPHTHALATE FILM FOR CELL PACKAGING MATERIAL, CELL PACKAGING MATERIAL, METHOD FOR MANUFACTURING CELL PACKAGING MATERIAL, AND CELL | 大日本印刷株式会社 | 2019-10-03 | — | — | WO | disclosed |
| CN-103491206-B | Carry by electronic communication device and manufacture method thereof | 现代摩比斯株式会社 | 2016-06-08 | — | — | CN | disclosed |