Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BACE1 | P56817 | 1/20 | 0.38 |
| ▸ | GLA | P06280 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | NOS3 | P29474 | 1/20 | 0.31 |
| ▸ | NOS1 | P29475 | 1/20 | 0.31 |
| ▸ | NOS2 | P35228 | 1/20 | 0.31 |
| ▸ | PDPK1 | O15530 | 1/20 | 0.31 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.30 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL157393 | 0.91 | NOS2 (0.36) | BACE1NOS3NOS1NOS2PDPK1 | |
| SCHEMBL16267855 | 0.89 | BACE1 (0.32) | BACE1NOS3NOS1NOS2PDPK1 | |
| SCHEMBL11429116 | 0.80 | GPR84 (0.35) | MAPT | |
| SCHEMBL2157690 | 0.78 | KDM4E (0.35) | PDPK1MAPTADORA1 | |
| SCHEMBL10725121 | 0.71 | CASP1 (0.46) | BACE1GLACYP1A2ALDH1A1HSD17B10 | |
| SCHEMBL21409794 | 0.69 | HTR2A (0.35) | ALDH1A1PDPK1 | |
| SCHEMBL8012754 | 0.68 | SREBF2 (0.41) | GLAALDH1A1HSD17B10MAPTADORA1 | |
| SCHEMBL1396274 | 0.67 | — | — | |
| SCHEMBL8324752 | 0.66 | KDM4E (0.38) | CYP1A2ALDH1A1MAPTADORA1 | |
| SCHEMBL6237802 | 0.66 | L3MBTL1 (0.41) | CYP1A2ALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 756 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021096237-A1 | EPOXY COMPOSITE COMPOSITION AND SEMICONDUCTOR PACKAGE COMPRISING SAME | 주식회사 테라온 | 2021-05-20 | — | — | WO | claimed |
| EP-2736999-B1 | FLEXIBLE BISMALEIMIDE, BENZOXAZINE, EPOXY-ANHYDRIDE ADDUCT HYBRID ADHESIVE | PROTAVIC KOREA CO LTD (KR) | 2018-11-07 | — | — | EP | claimed |
| EP-2736999-A1 | FLEXIBLE BISMALEIMIDE, BENZOXAZINE, EPOXY-ANHYDRIDE ADDUCT HYBRID ADHESIVE | Protavic Korea Co., Ltd. (KR) | 2014-06-04 | — | — | EP | claimed |
| US-20140034367-A1 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-02-06 | — | — | US | claimed |
| US-20130288041-A1 | EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LALMINATE | SEKISUI CHEMICAL CO LTD (JP) | 2013-10-31 | — | — | US | claimed |
| WO-2013015469-A1 | FLEXIBLE BISMALEIMIDE, BENZOXAZINE, EPOXY-ANHYDRIDE ADDUCT HYBRID ADHESIVE | PROTAVIC KOREA CO., LTD. (KR) | 2013-01-31 | — | — | WO | claimed |
| US-20110189432-A1 | EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LAMINATE | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-08-04 | — | — | US | claimed |
| US-7901768-B2 | Multilayer anisotropic conductive adhesive and connection structure using the same | SONY CORPORATION (JP) | 2011-03-08 | — | — | US | claimed |
| US-7737199-B2 | enhanced adhesion to sheet molding compound; improved toughness, impact resistance; for use in vehicle assembly | ASHLAND LICENSING & INTELLECTUAL PROPERTY LLC (US) | 2010-06-15 | — | — | US | claimed |
| US-20070054114-A1 | Multilayer anisotropic conductive adhesive and connection structure using the same | SONY CORPORATION (JP) | 2007-03-08 | — | — | US | claimed |
| JP-58225121-A | — | — | None | — | — | JP | disclosed |
| WO-2024150793-A1 | POLYCRYSTALLINE FORM OF BIPHENOL DIGLYCIDYL ETHER, AND RESIN COMPOSITION CONTAINING SAID POLYCRYSTALLINE FORM AND CURED PRODUCT THEREOF | 三菱ケミカル株式会社 | 2024-07-18 | — | — | WO | disclosed |
| US-20240239974-A1 | RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| WO-2024143121-A1 | ADHESIVE COMPOSITION, LAMINATE WITH ADHESIVE LAYER, FLEXIBLE COPPER CLAD LAMINATE, AND FLEXIBLE FLAT CABLE | 東亞合成株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024142662-A1 | RESIN MATERIAL, CURED ARTICLE, AND MULTILAYER PRINTED WIRING BOARD | 積水化学工業株式会社 | 2024-07-04 | — | — | WO | disclosed |
| US-6030701-A | Melt-flowable materials and method of sealing surfaces | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2000-02-29 | — | — | US | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0881066-A2 | Melt-flowable materials and method of sealing surfaces | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1998-12-02 | — | — | EP | disclosed |
| EP-0799874-A2 | Topographical method | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1997-10-08 | — | — | EP | disclosed |
| JP-S58225121-A | EPOXY RESIN COMPOSITION AND SEALING OF ELECTRONIC PARTS USING THE SAME | SANYUREJIN KK | 1983-12-27 | — | — | JP | disclosed |