SCHEMBL21658445

SCHEMBL21658445

COc1cccc(B(c2cccc(OC)c2)c2cccc(OC)c2)c1

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 1/20 0.69
ACHE P22303 1/20 0.54
CA4 P22748 1/20 0.52
CA1 P00915 2/20 0.52
CA2 P00918 2/20 0.52
CA7 P43166 2/20 0.52
CA9 Q16790 2/20 0.52
ALDH1A1 P00352 1/20 0.52
CYP3A4 P08684 1/20 0.52
RELA Q04206 1/20 0.48
CES2 O00748 1/20 0.47
CES1 P23141 1/20 0.47
CA12 O43570 1/20 0.46
CA14 Q9ULX7 1/20 0.46
CHRM5 P08912 1/20 0.45
LTA4H P09960 1/20 0.44
IDO1 P14902 1/20 0.44
AGXT P21549 1/20 0.44
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13617461 0.84 ENPP2 (0.67) ENPP2ACHECA4CA1CA2
SCHEMBL14986000 0.82 ENPP2 (0.64) ENPP2ACHECA4CA1CA2
SCHEMBL5140 0.82 ENPP2 (1.00) ENPP2ACHECA4CA1CA2
SCHEMBL17236462 0.82 ENPP2 (0.64) ENPP2ACHECA4CA1CA2
SCHEMBL7344145 0.82 ENPP2 (1.00) ENPP2ACHECA4CA1CA2
SCHEMBL12524808 0.80 ENPP2 (0.74) ENPP2ACHECA4CA1CA2
Methyl Alcohol SCHEMBL28712606 0.80 ENPP2 (0.96) ENPP2ACHECA4CA1CA2
1,3-Dimethoxybenzene SCHEMBL901285 0.79 ACHE (0.70) ENPP2ACHECA4CA1CA2
1,3-Dimethoxybenzene SCHEMBL9350 0.79 ACHE (0.70) ENPP2ACHECA4CA1CA2
SCHEMBL4618451 0.79 ENPP2 (0.71) ENPP2ACHECA4CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
WO-2023162552-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
US-20230127914-A1 RESIST PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-04-27 US disclosed
US-20230127914-A1 RESIST PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-04-27 US disclosed
CN-115160096-A Method for preparing aryl amide compound under conditions of no catalyst and no coupling agent 湖北沙洋荆氟化工科技有限公司 2022-10-11 CN disclosed
US-20210356863-A1 CHEMICAL AMPLIFICATION-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF PATTERNED RESIST LAYER, PRODUCTION METHOD OF PLATED MOLDED ARTICLE, COMPOUND, AND PRODUCTION METHOD OF COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2021-11-18 US disclosed
US-11016387-B2 Chemically amplified positive-type photosensitive resin composition, method of manufacturing substrate with template, and method of manufacturing plated article TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-25 US disclosed
CN-112020520-A Method for producing allyl monomer copolymer having polar group 国立大学法人东京大学 2020-12-01 CN disclosed
US-20200209739-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2020-07-02 US disclosed
US-20200150541-A1 METHOD OF FORMING RESIST PATTERN, RESIST COMPOSITION AND METHOD OF PRODUCING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-14 US disclosed
US-20200033729-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-01-30 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200209739-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND CUTA, RAD51, PCNA ENPP2 913/4885ACHE 4431/4885CA4 1013/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.