SCHEMBL21662877

SCHEMBL21662877

CC1(C)NCCCc2cc(C3CCc4ccccc4C(C)(C)O3)ccc21

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
EDNRB P24530 1/20 0.31
EDNRA P25101 1/20 0.31
KDM1A O60341 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26327444 0.76 KDM1A (0.46) EDNRBEDNRAKDM1A
SCHEMBL327743 0.67 HTR2A (0.43) KDM1A
SCHEMBL29674239 0.67 HTR2A (0.43) KDM1A
SCHEMBL26705154 0.67 MAPK1 (0.36)
Hydrochloric Acid SCHEMBL1952104 0.66 HTR2A (0.42) KDM1A
SCHEMBL3542185 0.60 ALDH1A1 (0.43)
Hydrochloric Acid SCHEMBL9375331 0.60 EDNRB (0.44) EDNRBEDNRAKDM1A
SCHEMBL26327443 0.58 KDM1A (0.46) KDM1A
Hydrochloric Acid SCHEMBL5199073 0.57 HTR2A (0.40) EDNRBEDNRAKDM1A
SCHEMBL12549679 0.57 PARP10 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed