SCHEMBL21662882

SCHEMBL21662882

CN1CCCc2ccccc2C1(C)C

nearest known ligand 0.46

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
DRD1 P21728 5/20 0.45
DRD5 P21918 5/20 0.45
DRD2 P14416 4/20 0.45
DRD4 P21917 4/20 0.45
DRD3 P35462 4/20 0.45
KDM1A O60341 1/20 0.45
SIGMAR1 Q99720 5/20 0.43
EBP Q15125 1/20 0.43
MAPK1 P28482 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
CHRM2 P08172 1/20 0.42
ADRA2A P08913 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7654995 0.89 DRD2 (0.45) DRD1DRD5DRD2DRD4DRD3
Bromomethane SCHEMBL7768740 0.84 ALDH1A1 (0.42) DRD1DRD5DRD2DRD4DRD3
SCHEMBL7768742 0.81 ALDH1A1 (0.40) DRD1DRD5DRD2DRD4DRD3
SCHEMBL26705154 0.80 MAPK1 (0.36) DRD1DRD5DRD2DRD4DRD3
SCHEMBL18559550 0.76 HTR2A (0.39)
SCHEMBL26705053 0.75 ALDH1A1 (0.42) DRD1DRD5DRD2DRD4DRD3
SCHEMBL17014512 0.73 SIGMAR1 (0.44) SIGMAR1EBPMAPK1SMN1; SMN2
SCHEMBL28130033 0.72 ALDH1A1 (0.44) DRD1DRD5DRD2DRD4DRD3
SCHEMBL9375592 0.71 SIGMAR1 (0.41) DRD2SIGMAR1EBPMAPK1SMN1; SMN2
SCHEMBL20618801 0.70 ALDH1A1 (0.43) DRD1DRD5DRD2DRD4DRD3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed