SCHEMBL216633

SCHEMBL216633

CCC(F)C(F)(F)S(=O)(=O)O

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL5470175 0.98 ALDH1A1 (0.31) ALDH1A1L3MBTL1
Dimethylamine SCHEMBL18008596 0.94
Allylamine SCHEMBL18008785 0.85 ALDH1A1 (0.31) ALDH1A1
Pyridine SCHEMBL18008140 0.84 TSHR (0.30)
SCHEMBL18008240 0.82
SCHEMBL3139960 0.82 TP53 (0.32) ALDH1A1L3MBTL1
Pyrogallol SCHEMBL28380302 0.81 CA1 (0.38) ALDH1A1
SCHEMBL14775259 0.80
SCHEMBL3128996 0.79 TP53 (0.38)
SCHEMBL9169466 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8088566-B2 Photoresists; using compound containing an orgaooxygen or organosulfur compound FUJIFILM CORPORATION (JP) 2012-01-03 US claimed
US-20260133489-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO LTD (KR) 2026-05-14 US disclosed
CN-122018230-A Photosensitive resin composition, photosensitive resin layer, and semiconductor device using the photosensitive resin layer 三星SDI株式会社 2026-05-12 CN disclosed
US-20260063996-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO LTD (KR) 2026-03-05 US disclosed
US-20260062515-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO LTD (KR) 2026-03-05 US disclosed
US-20260003271-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO LTD (KR) 2026-01-01 US disclosed
US-20250291248-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2025-09-18 US disclosed
CN-112771447-B Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device 三星SDI株式会社 2025-06-03 CN disclosed
US-20250020997-A1 PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-01-16 US disclosed
US-12084592-B2 Coating composition for pattern inversion NISSAN CHEMICAL CORPORATION (JP) 2024-09-10 US disclosed
EP-1690685-A2 Planographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2006-08-16 EP disclosed
EP-1676835-A1 PROCESS FOR PRODUCING TRIARYLSULFONIUM SALT Wako Pure Chemical Industries, Ltd. (JP) 2006-07-05 EP disclosed
US-20050233253-A1 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 2005-10-20 US disclosed
US-20050020710-A1 Hybrid onium salt WAKO PURE CHEMICALS INDUSTRIES, LTD. (JP) 2005-01-27 US disclosed
US-20040247900-A1 Antireflective film material, and antireflective film and pattern formation method using the same SHIN-ETSU CHEMICAL CO. LTD. (JP) 2004-12-09 US disclosed
EP-1481973-A1 HETEROCYCLE-BEARING ONIUM SALTS Wako Pure Chemical Industries, Ltd. (JP) 2004-12-01 EP disclosed
EP-1443042-A1 HYBRID ONIUM SALT Wako Pure Chemical Industries, Ltd. (JP) 2004-08-04 EP disclosed
US-6599922-B2 Process for the preparation of 2,5-bis-(2,2,2-trifluoroethoxy)-N-(2-piperidylmethyl)-benzamide (FLECAINIDE) A.M.S.A. ANONIMA MATERIE SINTETICHE E AFFINI S.P.A. (IT) 2003-07-29 US disclosed
US-20030032835-A1 Antiarrhythmia agents A.M.S.A. ANONIMA MATERIE SINTETICHE E AFFINI S.P.A (IT) 2003-02-13 US disclosed
EP-1283201-A1 Process for the preparation of 2,5-bis-(2,2,2-trifluoroethoxy)-n-(2-piperidyl-methyl)-benzamide (flecanide) A.M.S.A. ANONIMA MATERIE SINTETICHE E AFFINI S.p.A. (IT) 2003-02-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20050233253-A1 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether NOX4, CBR1, CBR3 ALDH1A1 1190/4885L3MBTL1 4079/4885
US-20260003271-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME KDM1A, KDM2A, KDM3A ALDH1A1 347/4885L3MBTL1 1566/4885
US-20260133489-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME ASH2L, RER1, ARCN1 ALDH1A1 1071/4885L3MBTL1 2981/4885
US-20260062515-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME RPS4Y1, ASH2L, KDM4D ALDH1A1 1209/4885L3MBTL1 2477/4885
US-20260063996-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME ASH2L, FCER2, TAS1R2 ALDH1A1 939/4885L3MBTL1 2396/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.