SCHEMBL216951

SCHEMBL216951

C=COCC1CCC(Cc2c(C(=O)O)ccc(C(=O)O)c2CC2CCC(COC=C)CC2)CC1

nearest known ligand 0.32

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
PARP15 Q460N3 1/20 0.32
PARP10 Q53GL7 1/20 0.32
PARP2 Q9UGN5 1/20 0.32
KDM4C Q9H3R0 2/20 0.31
LPL P06858 1/20 0.31
LIPG Q9Y5X9 1/20 0.31
NOTUM Q6P988 1/20 0.31
KDM5B Q9UGL1 1/20 0.30
KDM5A P29375 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1389367 0.88
SCHEMBL702949 0.82 NR1H4 (0.38) PARP15PARP10PARP2
SCHEMBL2456726 0.82 NR1H4 (0.38) PARP15PARP10PARP2
SCHEMBL3722748 0.82 GRIK1 (0.46)
SCHEMBL10010079 0.79 PARP10 (0.45) PARP15PARP10PARP2
SCHEMBL1073031 0.76 ESR1 (0.38) KDM4CLIPGNOTUMKDM5BKDM5A
SCHEMBL14659393 0.74 NOTUM (0.38) KDM4CLIPGNOTUMKDM5BKDM5A
SCHEMBL6049060 0.73 NR1H4 (0.38) PARP15PARP10PARP2
SCHEMBL2456728 0.72 DRD2 (0.44) PARP15PARP10PARP2
SCHEMBL28165784 0.72 ALDH1A1 (0.44) KDM4C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12098298-B2 Ultra-fast UV-cured material for repairing surface imperfections ILLINOIS TOOL WORKS INC. (US) 2024-09-24 US claimed
US-8304117-B2 Comprises bismaleimide oligomer formed by reaction of barbituric acid and bismaleimide INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-11-06 US claimed
US-20080160404-A1 Gel polymer electrolyte precursor and rechargeable cell comprising the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2008-07-03 US claimed
US-20060135705-A1 melting at least a portion of pellets or powder, the portion comprising a mixture of a functionalized polymer and a reactive monomer andflowing the molten portion into contact with the portion of the electronic or optical device GENERAL ELECTRIC COMPANY 2006-06-22 US claimed
EP-1373339-B1 SHAPE MEMORY STYRENE COPOLYMER JOHNSON & JOHNSON VISION CARE (US) 2006-01-18 EP claimed
US-12098298-B2 Ultra-fast UV-cured material for repairing surface imperfections ILLINOIS TOOL WORKS INC. (US) 2024-09-24 US disclosed
CN-110804276-A High-resolution photocuring three-dimensional printing compound 南京大学 2020-02-18 CN disclosed
US-9409793-B2 Spin coatable metallic hard mask compositions and processes thereof AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2016-08-09 US disclosed
US-9212244-B2 Polymers made from mixtures comprising vinyl ether monomers MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG (DE) 2015-12-15 US disclosed
US-9146467-B2 Coating compositions MERCK PATENT GMBH (DE) 2015-09-29 US disclosed
US-20150200090-A1 SPIN COATABLE METALLIC HARD MASK COMPOSITIONS AND PROCESSES THEREOF AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (US) 2015-07-16 US disclosed
US-20130236833-A1 COATING COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2013-09-12 US disclosed
US-20080160404-A1 Gel polymer electrolyte precursor and rechargeable cell comprising the same INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2008-07-03 US disclosed
US-20070292809-A1 Process for the Production of Double-Layer Heat-Sensitive Imageable Elements KODAK POLYCHROME GRAPHICS, GMBH (DE) 2007-12-20 US disclosed
US-20070286962-A1 Methods for producing non-glossy coatings from radiation curable compositions PPG INDUSTRIES OHIO, INC. 2007-12-13 US disclosed
US-7297370-B2 melting at least a portion of pellets or powder, the portion comprising a mixture of a functionalized polymer and a reactive monomer andflowing the molten portion into contact with the portion of the electronic or optical device GENERAL ELECTRIC COMPANY (US) 2007-11-20 US disclosed
EP-1673222-A1 PROCESS FOR PRODUCTION OF HEAT-SENSITIVE IMAGEABLE ELEMENTS Kodak Polychrome Graphics GmbH (DE) 2006-06-28 EP disclosed
US-20060135704-A1 Tack free compositions useful for electronic encapsulation GENERAL ELECTRIC COMPANY 2006-06-22 US disclosed
US-20060135705-A1 melting at least a portion of pellets or powder, the portion comprising a mixture of a functionalized polymer and a reactive monomer andflowing the molten portion into contact with the portion of the electronic or optical device GENERAL ELECTRIC COMPANY 2006-06-22 US disclosed
WO-2005039878-A1 PROCESS FOR PRODUCTION OF HEAT-SENSITIVE IMAGEABLE ELEMENTS KODAK POLYCHROME GRAPHICS GMBH (DE) 2005-05-06 WO disclosed