SCHEMBL217673

SCHEMBL217673

CCCCCCCCCCCc1nccn1C(C)C#N.O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.44

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.40
HPGD P15428 1/20 0.40
PTPN11 Q06124 2/20 0.38
RARB P10826 2/20 0.37
PPARA Q07869 1/20 0.37
AGTR1 P30556 1/20 0.37
AGTR2 P50052 1/20 0.37
PLA2G2A P14555 1/20 0.36
TP53 P04637 1/20 0.36
TSHR P16473 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL346573 1.00 ALDH1A1 (0.40) ALDH1A1HPGDPTPN11RARBPPARA
SCHEMBL29074072 0.92 AGTR1 (0.38) ALDH1A1HPGDPTPN11RARBAGTR1
SCHEMBL28441158 0.87 PTPN11 (0.39) PTPN11RARBPPARAAGTR1AGTR2
Benzoic Acid SCHEMBL28698248 0.87 AGTR1 (0.43) ALDH1A1RARBAGTR1AGTR2TP53
SCHEMBL28999554 0.85 AGTR1 (0.33) ALDH1A1HPGDPTPN11AGTR1AGTR2
Lithium Ion SCHEMBL22042264 0.85 LTB4R (0.32) ALDH1A1HPGDAGTR1AGTR2
Mellitic Acid SCHEMBL27720793 0.84 AGTR1 (0.35) RARBPPARAAGTR1AGTR2
SCHEMBL22322489 0.84 ALDH1A1 (0.30) ALDH1A1HPGD
SCHEMBL29147715 0.82 AGTR1 (0.44) ALDH1A1HPGDPTPN11RARBPPARA
SCHEMBL83433 0.82 TLR7 (0.36) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 489 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117727527-A Magnetic semi-fluid composition and inductor 深圳市优宝新材料科技有限公司 2024-03-19 CN claimed
CN-117534546-A Ternary phenol compound based on thymol and derivative epoxy resin 陕西师范大学 2024-02-09 CN claimed
CN-115968065-A Electric heating slurry and preparation method thereof 广东骏丰频谱股份有限公司 2023-04-14 CN claimed
CN-109957286-B Printing ink and preparation method and application thereof 深圳市百柔新材料技术有限公司 2021-11-23 CN claimed
CN-112480373-A Flame-retardant epoxy resin composition and preparation method and application thereof 广东广山新材料股份有限公司 2021-03-12 CN claimed
US-10570243-B2 Non-tin catalyst for curing alkoxysilyl-containing polymer MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-02-25 US claimed
EP-3494162-A1 NON-TIN CATALYST FOR CURING ALKOXYSILYL-CONTAINING POLYMER Momentive Performance Materials Inc. (US) 2019-06-12 EP claimed
WO-2018049375-A1 NON-TIN CATALYST FOR CURING ALKOXYSILYL-CONTAINING POLYMER MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-03-15 WO claimed
US-20180072837-A1 NON-TIN CATALYST FOR CURING ALKOXYSILYL-CONTAINING POLYMER MOMENTIVE PERFORMANCE MATERIALS INC. 2018-03-15 US claimed
US-20170121520-A1 DIELECTRIC COMPOSITE MATERIAL FOR FINGERPRINT SENSOR INDUCTION LAYER AND PREPARATION METHOD THEREOF TECORE SYNCHEM INC. 2017-05-04 US claimed
US-8420177-B2 Method for preparing functional multilayer anisotropic conductive adhesive film SHENZHEN DIANBOND TECHNOLOGY CO., LTD (CN) 2013-04-16 US claimed
US-20120276284-A1 METHOD FOR PREPARING FUNCTIONAL MULTILAYER ANISOTROPIC CONDUCTIVE ADHESIVE FILM GUANGDONG DONGBONG TECHNOLOGY CO., LTD 2012-11-01 US claimed
US-8241750-B2 Functional multilayer anisotropic conductive adhesive laminate Guangdong Dongbond Technology Co., Ltd. (CN) 2012-08-14 US claimed
US-20090269574-A1 FUNCTIONAL MULTILAYER ANISOTROPIC CONDUCTIVE ADHESIVE FILM AND METHOD FOR PREPARING THE SAME GUANGDONG DONGBOND TECHNOLOGY CO., LTD (CN) 2009-10-29 US claimed
US-20060247341-A1 Complexes of zinc with substituted amidines and guanidines and aliphatic carboxylates, e.g., Zn(1-methylimidazole)2(acetate)2 and Zn(tetramethylguanidine)2(formate)2; useful as catalysts for deblocking blocked isocyanates and in the production of urethanes and polyurethanes KING INDUSTRIES, INC. 2006-11-02 US claimed
US-20060036007-A1 Organometallic compositions and coating compositions KING INDUSTRIES, INC. (US) 2006-02-16 US claimed
CN-122094914-A Zeolite, resin composition, liquid sealing agent, underfill material, method for producing sealing material, and electronic device 2026-05-26 CN disclosed
WO-2026105512-A1 CLEAR COATING COMPOSITION 日本ペイント・オートモーティブコーティングス株式会社 2026-05-21 WO disclosed
EP-0245018-A2 Epoxy resin composition MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-11-11 EP disclosed
US-4501853-A HEATING, STIRRING WITH LIQUID RUBBER, VULCANIZATION RUBBER TO GIVE DISPERSION SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 1985-02-26 US disclosed