Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | PTPN11 | Q06124 | 2/20 | 0.38 |
| ▸ | RARB | P10826 | 2/20 | 0.37 |
| ▸ | PPARA | Q07869 | 1/20 | 0.37 |
| ▸ | AGTR1 | P30556 | 1/20 | 0.37 |
| ▸ | AGTR2 | P50052 | 1/20 | 0.37 |
| ▸ | PLA2G2A | P14555 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL217673 | 1.00 | ALDH1A1 (0.40) | ALDH1A1HPGDPTPN11RARBPPARA | |
| SCHEMBL29074072 | 0.92 | AGTR1 (0.38) | ALDH1A1HPGDPTPN11RARBAGTR1 | |
| SCHEMBL28441158 | 0.87 | PTPN11 (0.39) | PTPN11RARBPPARAAGTR1AGTR2 | |
| Benzoic Acid SCHEMBL28698248 | 0.87 | AGTR1 (0.43) | ALDH1A1RARBAGTR1AGTR2TP53 | |
| SCHEMBL28999554 | 0.85 | AGTR1 (0.33) | ALDH1A1HPGDPTPN11AGTR1AGTR2 | |
| Lithium Ion SCHEMBL22042264 | 0.85 | LTB4R (0.32) | ALDH1A1HPGDAGTR1AGTR2 | |
| Mellitic Acid SCHEMBL27720793 | 0.84 | AGTR1 (0.35) | RARBPPARAAGTR1AGTR2 | |
| SCHEMBL22322489 | 0.84 | ALDH1A1 (0.30) | ALDH1A1HPGD | |
| SCHEMBL29147715 | 0.82 | AGTR1 (0.44) | ALDH1A1HPGDPTPN11RARBPPARA | |
| SCHEMBL83433 | 0.82 | TLR7 (0.36) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1548 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112724867-B | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2023-01-10 | — | — | CN | claimed |
| US-20220077099-A1 | COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) | 2022-03-10 | — | — | US | claimed |
| CN-113150494-A | PCB micro-foaming hole plugging resin and preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2021-07-23 | — | — | CN | claimed |
| CN-112724867-A | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2021-04-30 | — | — | CN | claimed |
| CN-108530836-B | Composite material for low-temperature reinforced lining plate and low-temperature reinforced lining plate thereof | 浙江吉利汽车有限公司 | 2021-03-23 | — | — | CN | claimed |
| EP-3497147-A1 | ANHYDRIDE EPOXY CURING AGENTS HAVING IMIDAZOLE SALT ADDITIVES FOR EPOXY RESIN SYSTEMS | Evonik Degussa GmbH (DE) | 2019-06-19 | — | — | EP | claimed |
| US-10150898-B2 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads | XEROX CORPORATION (US) | 2018-12-11 | — | — | US | claimed |
| WO-2018035007-A1 | ANHYDRIDE EPOXY CURING AGENTS HAVING IMIDAZOLE SALT ADDITIVES FOR EPOXY RESIN SYSTEMS | EVONIK DEGUSSA GMBH (DE) | 2018-02-22 | — | — | WO | claimed |
| US-9890306-B2 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads | XEROX CORPORATION (US) | 2018-02-13 | — | — | US | claimed |
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | claimed |
| US-20090230570-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME | KABUSHIKI KAISHA TOSHIBA (JP) | 2009-09-17 | — | — | US | claimed |
| US-20080261049-A1 | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-10-23 | — | — | US | claimed |
| US-20060051587-A1 | Thermosetting resin composition and adhesive film | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-03-09 | — | — | US | claimed |
| JP-2127418-A | — | — | None | — | — | JP | disclosed |
| US-12630695-B2 | Resin composition comprising two types of particles for acoustic member, ultrasound transducer, ultrasound probe, and ultrasound diagnostic apparatus | Konica Minolta, Inc. (JP) | 2026-05-19 | — | — | US | disclosed |
| US-12630668-B2 | Liquid compression molding material | NAMICS CORPORATION (JP) | 2026-05-19 | — | — | US | disclosed |
| EP-0353089-A2 | Thermosetting epoxy resin composition | Tonen Corporation (JP) | 1990-01-31 | — | — | EP | disclosed |
| EP-0335706-A2 | Thermocurable epoxy resin composition | TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) | 1989-10-04 | — | — | EP | disclosed |
| EP-0319919-A2 | Adhesive composition | DAIKIN INDUSTRIES, LIMITED (JP) | 1989-06-14 | — | — | EP | disclosed |
| EP-0295639-A2 | Fluorine-containing alicyclic and aromatic cyclic compounds, process thereof and adhesive composition containing the compounds | DAIKIN INDUSTRIES, LIMITED (JP) | 1988-12-21 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12630695-B2 | Resin composition comprising two types of particles for acoustic member, ultrasound transducer, ultrasound probe, and ultrasound diagnostic apparatus | FUS, PUF60, PRPF31 | ALDH1A1 1666/4885HPGD 4591/4885PTPN11 4531/4885 |
| US-12630668-B2 | Liquid compression molding material | PIEZO1, TSNAX, TMCO1 | ALDH1A1 3204/4885HPGD 4304/4885PTPN11 766/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.