SCHEMBL21794264

SCHEMBL21794264

O=S(=O)(O)c1c(-c2ccccc2)cccc1-c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
PTGS2 P35354 1/20 0.45
ALDH1A1 P00352 3/20 0.44
HSD17B10 Q99714 2/20 0.44
HPGD P15428 1/20 0.44
BCL2L1 Q07817 1/20 0.44
HNF4A P41235 1/20 0.44
HDAC4 P56524 1/20 0.43
HDAC2 Q92769 1/20 0.43
HDAC8 Q9BY41 1/20 0.43
HDAC6 Q9UBN7 1/20 0.43
BCAT2 O15382 1/20 0.42
BACE1 P56817 1/20 0.41
DAPK1 P53355 1/20 0.41
PDCD1 Q15116 1/20 0.39
CD274 Q9NZQ7 1/20 0.39
P2RX7 Q99572 1/20 0.39
CYP2A6 P11509 1/20 0.39
MAPK1 P28482 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30166530 0.90 TSHR (0.41) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL392931 0.90 TSHR (0.41) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL29700247 0.88 ALDH1A1 (0.54) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
Hydrochloric Acid SCHEMBL11760140 0.88 PTGS2 (0.40) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL3042569 0.88 ALDH1A1 (0.54) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL6768154 0.86 DAPK1 (0.39) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL7053927 0.86 CA12 (0.43) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
SCHEMBL11437056 0.85 PDCD1 (0.53) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
Formaldehyde SCHEMBL5123936 0.85 ALDH1A1 (0.50) TSHRSMN1; SMN2PTGS2ALDH1A1HSD17B10
Urea SCHEMBL4970936 0.83 BCAT2 (0.46) TSHRSMN1; SMN2PTGS2HNF4ABCAT2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023162837-A1 POSITIVE ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND 富士フイルム株式会社 2023-08-31 WO disclosed
WO-2023162838-A1 ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-08-31 WO disclosed
US-20230038825-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FOR MANUFACTURING PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK FUJIFILM CORPORATION (JP) 2023-02-09 US disclosed
WO-2023008347-A1 ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE 富士フイルム株式会社 2023-02-02 WO disclosed
US-20220206386-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-06-30 US disclosed
US-20210165325-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND FUJIFILM CORPORATION (JP) 2021-06-03 US disclosed
WO-2020045534-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND 富士フイルム株式会社 2020-03-05 WO disclosed