SCHEMBL2187802

SCHEMBL2187802

CCOc1c(O)ccc2ccc(O)cc12

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.43
ALOX5 P09917 1/20 0.42
ESR1 P03372 5/20 0.41
ESR2 Q92731 4/20 0.41
CA12 O43570 2/20 0.41
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
CA7 P43166 2/20 0.41
CA9 Q16790 2/20 0.41
CA14 Q9ULX7 2/20 0.41
LTA4H P09960 1/20 0.39
RAD52 P43351 1/20 0.39
MCL1 Q07820 1/20 0.39
GAA P10253 1/20 0.38
MAOB P27338 1/20 0.37
ALDH1A1 P00352 1/20 0.37
LMNA P02545 1/20 0.37
GFER P55789 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30220176 1.00 IDO1 (0.43) IDO1ALOX5ESR1ESR2CA12
SCHEMBL7595465 0.80 ALOX5 (0.54) IDO1ALOX5GAAALDH1A1
SCHEMBL2187208 0.79 ESR1 (0.62) ESR1ESR2CA12CA1CA2
SCHEMBL29493121 0.79 ESR1 (0.62) ESR1ESR2CA12CA1CA2
SCHEMBL21834204 0.79 ESR1 (0.43) ESR1ESR2MCL1MAOBLMNA
SCHEMBL30048366 0.79 ESR1 (0.43) ESR1ESR2MCL1MAOBLMNA
SCHEMBL11131743 0.76 NQO1 (0.46) ESR1ESR2CA12CA1CA2
SCHEMBL10871759 0.72 ALOX5 (0.43) ALOX5ESR1ESR2LTA4HRAD52
SCHEMBL2185013 0.72 ESR1 (0.45) ESR1ESR2RAD52MCL1GAA
SCHEMBL30220142 0.72 ESR1 (0.45) ESR1ESR2RAD52MCL1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240270891-A1 PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN DIC CORPORATION (JP) 2024-08-15 US disclosed
CN-116209690-A Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2023-06-02 CN disclosed
CN-115873214-A Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film DIC株式会社 2023-03-31 CN disclosed
WO-2022065041-A1 RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP DIC株式会社 2022-03-31 WO disclosed
EP-2343327-B1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME DAINIPPON INK & CHEMICALS (JP) 2013-07-24 EP disclosed
US-8168731-B2 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same DIC CORPORATION (JP) 2012-05-01 US disclosed
US-20110259628-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, EPOXY RESIN, AND PROCESS FOR PRODUCING THE SAME DIC CORPORATION (JP) 2011-10-27 US disclosed
EP-2343327-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME DIC Corporation (JP) 2011-07-13 EP disclosed