SCHEMBL2187208

SCHEMBL2187208

COc1c(O)ccc2ccc(O)cc12

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.62
ESR2 Q92731 3/20 0.62
MAOB P27338 1/20 0.50
TDP1 Q9NUW8 1/20 0.45
AURKA O14965 1/20 0.44
CDK1 P06493 1/20 0.44
CDK4 P11802 1/20 0.44
CDK2 P24941 1/20 0.44
AURKB Q96GD4 1/20 0.44
CA12 O43570 2/20 0.43
CA1 P00915 2/20 0.43
CA7 P43166 2/20 0.43
CA9 Q16790 2/20 0.43
CA13 Q8N1Q1 1/20 0.43
MCL1 Q07820 2/20 0.42
ABL1 P00519 2/20 0.42
GFER P55789 1/20 0.42
ABCB1 P08183 1/20 0.42
BCR P11274 1/20 0.42
CALCRL Q16602 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29493121 1.00 ESR1 (0.62) ESR1ESR2MAOBTDP1AURKA
SCHEMBL9623607 0.86 ESR1 (0.75) ESR1ESR2MAOBTDP1AURKA
SCHEMBL30048366 0.83 ESR1 (0.43) ESR1ESR2MAOBTDP1CDK4
SCHEMBL21834204 0.83 ESR1 (0.43) ESR1ESR2MAOBTDP1CDK4
SCHEMBL28136342 0.82 ESR2 (0.51) ESR1ESR2TDP1CA12CA1
SCHEMBL30220176 0.79 IDO1 (0.43) ESR1ESR2MAOBCA12CA1
SCHEMBL2187802 0.79 IDO1 (0.43) ESR1ESR2MAOBCA12CA1
SCHEMBL3818138 0.78 ESR1 (0.54) ESR1ESR2TDP1GAAPOLB
SCHEMBL12486732 0.77 ESR1 (0.54) ESR1ESR2TDP1CA12CA1
SCHEMBL31570914 0.77 ESR1 (0.54) ESR1ESR2TDP1CA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0359037-A2 Low-viscosity polyamide mouldings and mixtures BAYER AG (DE) 1990-03-21 EP claimed
US-20240270891-A1 PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN DIC CORPORATION (JP) 2024-08-15 US disclosed
CN-116209690-A Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2023-06-02 CN disclosed
CN-115873214-A Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film DIC株式会社 2023-03-31 CN disclosed
EP-2343327-B1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME DAINIPPON INK & CHEMICALS (JP) 2013-07-24 EP disclosed
US-8168731-B2 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same DIC CORPORATION (JP) 2012-05-01 US disclosed
US-20110259628-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, EPOXY RESIN, AND PROCESS FOR PRODUCING THE SAME DIC CORPORATION (JP) 2011-10-27 US disclosed
EP-2343327-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME DIC Corporation (JP) 2011-07-13 EP disclosed