SCHEMBL30048366

SCHEMBL30048366

Oc1ccc2ccc(O)c(Oc3c(O)ccc4ccc(O)cc34)c2c1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 8/20 0.43
ESR2 Q92731 8/20 0.43
MCL1 Q07820 1/20 0.40
MAOB P27338 1/20 0.39
CYP1A2 P05177 1/20 0.38
LMNA P02545 1/20 0.38
CDK4 P11802 1/20 0.37
CCND1 P24385 1/20 0.37
MPL P40238 1/20 0.36
PTPN22 Q9Y2R2 1/20 0.35
CYP3A4 P08684 1/20 0.35
ALOX15 P16050 1/20 0.35
TSHR P16473 1/20 0.35
HIF1A Q16665 1/20 0.35
HSD17B10 Q99714 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
F12 P00748 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21834204 1.00 ESR1 (0.43) ESR1ESR2MCL1MAOBCYP1A2
SCHEMBL29493121 0.83 ESR1 (0.62) ESR1ESR2MCL1MAOBCDK4
SCHEMBL2187208 0.83 ESR1 (0.62) ESR1ESR2MCL1MAOBCDK4
SCHEMBL2187802 0.79 IDO1 (0.43) ESR1ESR2MCL1MAOBLMNA
SCHEMBL30220176 0.79 IDO1 (0.43) ESR1ESR2MCL1MAOBLMNA
SCHEMBL70005 0.76 PTPN22 (0.58) CYP1A2LMNAPTPN22TSHRHSD17B10
SCHEMBL670670 0.75 CYP1A2 (0.52) ESR1ESR2MCL1CYP1A2LMNA
SCHEMBL10956772 0.75 ALOX5 (0.43) ESR1ESR2CYP1A2PTPN22HIF1A
SCHEMBL12251173 0.75 ESR1 (0.44) ESR1ESR2MCL1CYP1A2LMNA
SCHEMBL3212292 0.75 PTPN22 (0.56) ESR1ESR2MCL1CYP1A2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4685172-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685171-A1 CURABLE COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC Corporation (JP) 2026-01-28 EP disclosed
EP-4685185-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND CURABLE COMPOUND DIC Corporation (JP) 2026-01-28 EP disclosed
CN-119137110-A Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-12-13 CN disclosed
CN-119095895-A Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-12-06 CN disclosed
CN-118974061-A Phenolic hydroxyl group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-11-15 CN disclosed
CN-118871425-A Hydroxyl group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-10-29 CN disclosed
CN-116829353-A Epoxy resin composition, cured product thereof, and laminate DIC株式会社 2023-09-29 CN disclosed
CN-111566141-B Epoxy compound, composition, cured product, and laminate DIC株式会社 2023-05-02 CN disclosed
CN-111527063-B Hydroxyl compound, composition, cured product, and laminate DIC株式会社 2022-11-08 CN disclosed