SCHEMBL2188285

SCHEMBL2188285

O=C(CS(=O)(=O)CS(=O)(=O)CC(=O)c1ccccc1)c1ccccc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.54
TDP1 Q9NUW8 2/20 0.54
MAPK1 P28482 2/20 0.54
CYP3A4 P08684 2/20 0.54
HPGD P15428 2/20 0.54
KDM4E B2RXH2 1/20 0.54
MEN1 O00255 1/20 0.54
ALOX15 P16050 1/20 0.54
CES1 P23141 1/20 0.54
KMT2A Q03164 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
L3MBTL1 Q9Y468 2/20 0.54
LMNA P02545 1/20 0.54
RECQL P46063 2/20 0.53
ALDH1A1 P00352 3/20 0.50
GSK3B P49841 2/20 0.50
PTPN1 P18031 2/20 0.50
HIF1A Q16665 2/20 0.50
TRPA1 O75762 1/20 0.50
HSD11B1 P28845 7/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1516246 0.91 MAPK1 (0.58) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL28406269 0.88 CA2 (0.49) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL8761020 0.85 RECQL (0.56) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL28420629 0.83 GSK3B (0.57) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL14079438 0.82 HSD11B1 (0.49) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL824467 0.82 ALDH1A1 (0.51) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL137832 0.80 MAPK1 (0.56) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL27722919 0.79 RECQL (0.46) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL260911 0.78 ALDH1A1 (0.56) MAPTTDP1MAPK1CYP3A4HPGD
SCHEMBL15791249 0.78 MAPK1 (0.54) MAPTTDP1MAPK1CYP3A4HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119836453-A Polymer, composition, cured product, and display element JSR株式会社 2025-04-15 CN disclosed
CN-118749078-A Photosensitive resin composition set, optical waveguide, method for producing optical waveguide, opto-electric hybrid board, sheet set, core resin composition, coating resin composition, and resin sheet 味之素株式会社 2024-10-08 CN disclosed
WO-2024053722-A1 POLYMER, COMPOSITION, CURED PRODUCT, AND DISPLAY ELEMENT JSR株式会社 2024-03-14 WO disclosed
WO-2023145537-A1 PHOTOSENSITIVE RESIN COMPOSITION SET, OPTICAL WAVEGUIDE AND METHOD FOR PRODUCING SAME, PHOTOELECTRIC HYBRID BOARD, SHEET SET, RESIN COMPOSITION FOR CORES, RESIN COMPOSITION FOR CLADDINGS, AND RESIN SHEET 味の素株式会社 2023-08-03 WO disclosed
CN-110120180-B Wiring member JSR株式会社(JP) 2023-01-13 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-107544208-B Negative photosensitive resin composition, spacer, protective film and liquid crystal display element 奇美实业股份有限公司 2022-05-31 CN disclosed
CN-114545738-A Positive photosensitive resin composition 味之素株式会社 2022-05-27 CN disclosed
CN-114326302-A Photosensitive resin composition 味之素株式会社 2022-04-12 CN disclosed
CN-110892296-B Composition for forming infrared-transmitting film, method for forming infrared-transmitting film, protective plate for display device, and display device JSR株式会社 2022-03-22 CN disclosed
US-20100196822-A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT OF THE COMPOSITION, AND METHOD OF PRODUCING INSULATING FILM JSR CORPORATION (JP) 2010-08-05 US disclosed
US-20100167204-A1 RADIATION-SENSITIVE INSULATION RESIN COMPOSITION, CURED ARTICLE, AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2010-07-01 US disclosed
US-7714033-B2 Photosensitive insulating resin composition, cured product thereof and electronic component comprising the same JSR CORPORATION (JP) 2010-05-11 US disclosed
US-20090239080-A1 PHOTOSENSITIVE INSULATION RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORPORATION (JP) 2009-09-24 US disclosed
EP-1892574-A1 Photosensitive insulating resin composition, cured product thereof and electronic component having the same JSR Corporation (JP) 2008-02-27 EP disclosed
US-20080045621-A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF AND ELECTRONIC COMPONENT COMPRISING THE SAME JSR CORPORATION (JP) 2008-02-21 US disclosed
US-20070027231-A1 Photosensitive insulating resin composition and cured product thereof JSR CORPORATION (JP) 2007-02-01 US disclosed
US-20060246371-A1 Photosensitive fluororesin composition, cured film obtained from the composition, and method of forming pattern JSR CORPORATION (JP) 2006-11-02 US disclosed
EP-1666969-A1 PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR Corporation (JP) 2006-06-07 EP disclosed
US-20040110084-A1 Photosensitive insulating resin composition and cured product thereof JSR CORPORATION (JP) 2004-06-10 US disclosed