SCHEMBL21886445

SCHEMBL21886445

O=C(O)c1ccccc1C(=O)N(C1CCCCC1)C1CCCCC1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 8/20 0.52
SLC6A4 P31645 8/20 0.52
SLC6A3 Q01959 3/20 0.52
KCNH2 Q12809 3/20 0.52
ABCC1 P33527 2/20 0.51
S1PR1 P21453 2/20 0.50
S1PR3 Q99500 1/20 0.50
LMNA P02545 2/20 0.49
MAPT P10636 1/20 0.49
HTT P42858 1/20 0.49
NPSR1 Q6W5P4 1/20 0.49
HPGD P15428 1/20 0.49
TSHR P16473 1/20 0.49
ALDH1A1 P00352 2/20 0.48
ALOX15 P16050 2/20 0.48
CYP2D6 P10635 1/20 0.48
KMT2A Q03164 2/20 0.47
KDM4E B2RXH2 1/20 0.47
MEN1 O00255 1/20 0.47
ALOX12 P18054 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9812817 0.93 SLC6A2 (0.57) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL29589341 0.85 SLC6A2 (0.51) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL28414939 0.85 SLC6A2 (0.51) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL2363287 0.84 SLC6A2 (0.53) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL21891511 0.83 TSHR (0.70) ABCC1LMNAMAPTHPGDTSHR
SCHEMBL15807707 0.81 SLC6A2 (0.51) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL1004218 0.80 LMNA (0.65) SLC6A2SLC6A4SLC6A3S1PR1S1PR3
SCHEMBL21891710 0.80 LMNA (0.50) SLC6A2SLC6A4SLC6A3KCNH2ABCC1
SCHEMBL9542128 0.79 LMNA (0.51) SLC6A2SLC6A4SLC6A3KCNH2S1PR1
SCHEMBL28633006 0.78 WDR5 (0.60) SLC6A2SLC6A4SLC6A3KCNH2ABCC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
WO-2020066975-A1 RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed
WO-2020054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-03-19 WO disclosed