SCHEMBL21944745

SCHEMBL21944745

CSc1cccc2c1C=CC(=N)C2=O

nearest known ligand 0.37

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MAP2K7 O14733 1/20 0.37
CDC25A P30304 1/20 0.37
CDC25B P30305 1/20 0.37
S100A4 P26447 3/20 0.37
PTPRC P08575 1/20 0.33
SOAT1 P35610 1/20 0.33
KDM4E B2RXH2 4/20 0.31
MAPT P10636 2/20 0.31
NSD2 O96028 1/20 0.31
MAPK1 P28482 1/20 0.31
ALDH1A1 P00352 2/20 0.31
SMN1; SMN2 Q16637 2/20 0.30
PABPC1 P11940 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22663787 0.82 PTPRC (0.31) S100A4PTPRC
SCHEMBL14806830 0.80 DAO (0.39) S100A4PTPRCKDM4EMAPTNSD2
SCHEMBL21181015 0.79 KDM4E (0.31) KDM4EALDH1A1
SCHEMBL23265553 0.77 MAP2K7 (0.35) MAP2K7CDC25ACDC25BS100A4PTPRC
SCHEMBL24759701 0.72 CA1 (0.38) CDC25BS100A4PTPRC
SCHEMBL14488751 0.72 BAZ2B (0.36) S100A4PTPRCKDM4EALDH1A1SMN1; SMN2
SCHEMBL22965285 0.70 PSIP1 (0.32) PTPRCALDH1A1SMN1; SMN2
SCHEMBL23422727 0.70 S100A4 (0.32) MAP2K7CDC25ACDC25BS100A4PTPRC
SCHEMBL18473410 0.70 ALOX15 (0.33) PTPRCALDH1A1SMN1; SMN2
SCHEMBL19221906 0.69 S100A4 (0.31) S100A4PTPRC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
EP-2586806-B1 Modified novolak phenolic resin, making method, and resist composition SHINETSU CHEMICAL CO (JP) 2020-04-29 EP disclosed