SCHEMBL22004489

SCHEMBL22004489

SCCCCc1ccc(-c2ccc(-c3ccccc3)cc2)cc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HDAC2 Q92769 3/20 0.51
▸ HDAC1 Q13547 2/20 0.50
▸ FFAR1 O14842 1/20 0.48
▸ MAOB P27338 2/20 0.48
▸ FDFT1 P37268 2/20 0.47
▸ TAAR1 Q96RJ0 2/20 0.47
▸ HSD11B1 P28845 1/20 0.46
▸ MAOA P21397 1/20 0.45
▸ HDAC3 O15379 1/20 0.45
▸ HDAC4 P56524 1/20 0.45
▸ HDAC7 Q8WUI4 1/20 0.45
▸ HDAC10 Q969S8 1/20 0.45
▸ HDAC11 Q96DB2 1/20 0.45
▸ HDAC8 Q9BY41 1/20 0.45
▸ HDAC6 Q9UBN7 1/20 0.45
▸ HDAC9 Q9UKV0 1/20 0.45
▸ HDAC5 Q9UQL6 1/20 0.45
▸ KCNH2 Q12809 1/20 0.44
▸ MGLL Q99685 1/20 0.44
▸ SIGMAR1 Q99720 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24372592 0.93 FFAR1 (0.50) HDAC2HDAC1FFAR1MAOBFDFT1
SCHEMBL30869989 0.89 HDAC2 (0.60) HDAC2HDAC1FFAR1MAOBFDFT1
SCHEMBL24372547 0.88 HDAC2 (0.45) HDAC2HDAC1FFAR1FDFT1TAAR1
SCHEMBL133186 0.86 MAOA (0.58) MAOBMAOASIGMAR1HTR2A
SCHEMBL24372725 0.85 MAOB (0.44) HDAC2HDAC1MAOBHSD11B1HDAC3
SCHEMBL13606188 0.84 SIGMAR1 (0.59) HDAC2HDAC1MAOBMAOAHDAC3
SCHEMBL13606187 0.84 SIGMAR1 (0.59) HDAC2HDAC1MAOBMAOAHDAC3
SCHEMBL128294 0.84 SIGMAR1 (0.59) HDAC2HDAC1MAOBMAOAHDAC3
SCHEMBL11510150 0.84 SIGMAR1 (0.59) HDAC2HDAC1MAOBMAOAHDAC3
SCHEMBL13606194 0.84 SIGMAR1 (0.59) HDAC2HDAC1MAOBMAOAHDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 — — EP disclosed
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